US2005189320A1PendingUtilityA1
Plasma processing method
Priority: Mar 4, 2003Filed: Apr 25, 2005Published: Sep 1, 2005
Est. expiryMar 4, 2023(expired)· nominal 20-yr term from priority
H10P 72/0602H10P 72/0421H10P 72/0604H01J 37/32935
46
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Claims
Abstract
A plasma processing method for performing plasma processing on a sample in accordance with a process recipe with the sample being placed on a sample table in which each of a plurality of areas is temperature-controlled by a temperature controller. The process recipe includes a plurality of temperature setting parameters for the sample table, and the plasma processing is performed on the sample in accordance with the process recipe which is prepared for each of a plurality of process steps.
Claims
exact text as granted — not AI-modified1 - 4 . (canceled)
5 . A plasma processing method for performing plasma processing on a sample in accordance with a process recipe with the sample being placed on a sample table in which each of a plurality of areas is temperature-controlled by a temperature control means, wherein
the process recipe includes a plurality of temperature setting parameters for the sample table, and the plasma processing is performed on the sample in accordance with the process recipe which is prepared for each of a plurality of process steps.
6 . A plasma processing method for performing plasma processing on a sample in accordance with a process recipe with the sample being placed on a sample table in which each of a plurality of areas is temperature-controlled by a temperature control means, wherein
the process recipe includes a plurality of temperature setting parameters for the sample table, and the plasma processing is performed on the sample in accordance with the process recipe for which at least one of set temperatures of the temperature setting parameters is altered in response to a processing result of a preceding process performed on the sample, the processing result being obtained prior to the plasma processing.
7 . The plasma processing method according to claim, wherein
the temperature control of the sample table is performed by using a sample temperature measurement means or a sample table temperature measurement means.
8 . The plasma processing method according to claim 5 , wherein
the plurality of areas are an inner part and an outer part of the sample table.
9 . The plasma processing method according to claim 6 , wherein
the temperature control of the sample table is performed by using a sample temperature measurement means or a sample table temperature measurement means.
10 . The plasma processing method according to claim 6 , wherein
the plurality of areas are an inner part and an outer part of the sample table.
11 . The plasma processing method according to claim 7 , wherein
the plurality of areas are an inner part and an outer part of the sample table.Join the waitlist — get patent alerts
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