Polymer film metalization

Abstract

Embodiments in accordance with the present invention eliminate the need for a subtractive metal patterning process to pattern the electrode above a ferroelectric polymer. Instead, a selective electroless deposition process is used. A conductive polymer is used as a seed layer for the electroless plating of the metal electrode. A cost saving is provided by eliminating the chemical costs associated with conventional resist removal processing. The methods also potentially eliminate the requirement for aggressive and environmentally unsafe chemical-based photoresist removal processes.

1 . (canceled)  
     
     
         2 . A method, comprising: 
 forming a conductive polymer layer on a ferroelectric polymer layer;    patterning the conductive polymer; and    depositing a conductive layer on the patterned conductive polymer layer.    
     
     
         3 . The method of  claim 2 , wherein said forming comprises forming the conductive polymer layer on the ferroelectric polymer layer using a spin deposition and cure process.  
     
     
         4 . The method of  claim 2 , wherein said patterning comprises using photoresist spin deposition to form a layer of photoresist on the conductive polymer layer, and exposing predetermined areas of the photoresist to a curing process.  
     
     
         5 . The method of  claim 2 , wherein said patterning comprises using lithography and plasma etch processes to pattern the conductive polymer.  
     
     
         6 . The method of  claim 2 , wherein said depositing comprises using an electroless plating process to deposit the conductive layer on the patterned conductive polymer layer.  
     
     
         7 . The method of  claim 6 , wherein said using an electroless plating process includes optimizing the deposition process to minimize conductive layer deposition on the sidewalls of the conductive polymer.  
     
     
         8 . A method for making a semiconductor substrate comprising: 
 providing a substrate including a ferroelectric polymer layer;    forming a conductive polymer layer on the ferroelectric polymer layer;    patterning the conductive polymer layer; and    depositing a conductive layer on the patterned conductive polymer layer.    
     
     
         9 . The method of  claim 8 , wherein said forming comprises forming a conductive polymer layer on the ferroelectric polymer layer using a spin deposition and cure process.  
     
     
         10 . The method of  claim 8 , wherein said patterning comprises using photoresist spin deposition to form a layer of photoresist on the conductive polymer layer, and exposing predetermined areas of the photoresist to a curing process.  
     
     
         11 . The method of  claim 8 , wherein said patterning comprises using lithography and plasma etch processes to pattern the conductive polymer.  
     
     
         12 . The method of  claim 8 , wherein said depositing comprises using an electroless plating process to deposit the conductive layer on the patterned conductive polymer layer.  
     
     
         13 . The method of  claim 12 , wherein said using an electroless plating process includes optimizing the deposition process to minimize conductive layer deposition on the sidewalls of the conductive polymer.  
     
     
         14 . A method for making a semiconductor substrate comprising: 
 providing a substrate including a patterned conductive polymer layer on top of the substrate; and    depositing a conductive layer on top of the patterned conductive polymer layer.    
     
     
         15 . The method of  claim 14 , wherein said providing comprises providing a substrate including a ferroelectric polymer layer underneath the patterned conductive polymer layer.  
     
     
         16 . The method of  claim 14 , wherein said providing comprises of forming a conductive polymer layer on the substrate and patterning the conductive polymer layer using lithography and etch processes.  
     
     
         17 . The method of  claim 14 , wherein said depositing comprises using an electroless plating process to deposit the conductive layer on top of the patterned conductive polymer layer.  
     
     
         18 . The method of  claim 17 , wherein said using an electroless plating process includes optimizing the deposition process to minimize conductive layer deposition on the sidewalls of the conductive polymer.