Electrical contacts for flexible displays

Abstract

A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.

1 . A flexible display device comprising: 
 a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical display components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;    a conductive layer coupling to said bottom surface wherein said openings expose at least a portion of said conductive layer; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical display components on said flexible substrate.    
     
     
         2 . A flexible display device as in  claim 1  wherein said conductive layer is patterned to form a plurality of conductors wherein each of said openings is electrically coupled to at least one of said plurality of conductors.  
     
     
         3 . A flexible display device as in  claim 2  wherein said electrical display components comprise at least one of (a) row electrodes of said flexible display device; (b) column electrodes of said flexible display device; and (c) integrated circuits, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         4 . (canceled)  
     
     
         5 . A flexible display device comprising: 
 a flexible substrate comprising electrical display components, said flexible substrate having a top surface, said top surface having openings cutting therethrough;    a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical display components on said flexible substrate.    
     
     
         6 . A flexible display device as in  claim 5  wherein said electrical display components comprise at least one of (a) row electrodes of said flexible display device; (b) column electrodes of said flexible display device; and (c) integrated circuits, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         7 . (canceled)  
     
     
         8 . A flexible Radio Frequency Identification (RF ID) device comprising: 
 a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical RF ID components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;    a conductive layer coupling to said bottom surface wherein said openings expose at least a portion of said conductive layer; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive region and second electrical contacts to said electrical RF ID components on said flexible substrate.    
     
     
         9 . A flexible RF ID device as in  claim 8  wherein said conductive region is patterned to form a plurality of conductors from said conductive region; and wherein each of said openings is electrically coupled to at least one of said plurality of conductors.  
     
     
         10 . A flexible RF ID device as in  claim 9  wherein said electrical RF ID components comprise at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         11 . (canceled)  
     
     
         12 . A flexible Radio Frequency Identification (RF ID) device comprising: 
 a flexible substrate comprising electrical RF ID components, said flexible substrate having a top surface, said top surface having openings cutting therethrough;    a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical RF ID components on said flexible substrate.    
     
     
         13 . A flexible RF ID device as in  claim 12  wherein said electrical RF ID components comprise at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         14 . (canceled)  
     
     
         15 . A flexible electronic device comprising: 
 a flexible substrate having a top surface and a bottom surface, said top surface comprising electrical components, said flexible substrate comprising openings cutting therethrough from said top surface to said bottom surface;    said bottom surface comprising a conductive region wherein said openings exposing at least a portion of said conductive region; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive region and second electrical contacts to said electrical components on said flexible substrate.    
     
     
         16 . A flexible electronic device as in  claim 15  wherein said conductive region is patterned to form a plurality of conductors from said conductive region; and wherein each of said openings is electrically coupled to at least one of said plurality of conductors.  
     
     
         17 . (canceled)  
     
     
         18 . (canceled)  
     
     
         19 . A flexible electronic device comprising: 
 a flexible substrate comprising electrical components, said flexible substrate having a top surface, said top surface having openings cutting therethrough;    a conductive layer disposed below said top surface wherein said openings exposing at least a portion of said conductive layer; and    conductive elements filling said openings to make first electrical contacts to at least a portion of said conductive layer and second electrical contacts to said electrical components on said flexible substrate.    
     
     
         20 . (canceled)  
     
     
         21 . (canceled)  
     
     
         22 . A method for fabricating a flexible display device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible display device, said flexible substrate having a bottom surface which comprises a conductive layer, said openings exposing at least a portion of said conductive layer;    filling said openings with a conductive material which makes electrical contact to at least a portion of said conductive layer, said conductive material also making electrical contact to electrical display components on said top surface.    
     
     
         23 . A method as in  claim 22  further comprising: 
 patterning said conductive layer, wherein said patterning forms a plurality of conductors from said conductive layer; and wherein each of said openings is electrically coupled to at least one of said plurality of conductors.    
     
     
         24 . (canceled)  
     
     
         25 . A method as in  claim 22 , wherein said conductive layer constitutes at least 10% of a thickness of said flexible substrate.  
     
     
         26 . A method for fabricating a flexible display device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible display device, said flexible substrate having a plurality of conductors disposed below said top surface, said openings exposing at least a portion of said plurality of conductors;    filling said openings with a conductive material which makes electrical contact to at least a portion of said plurality of conductors, said conductive material also for making electrical contact to electrical display components on said top surface.    
     
     
         27 . (canceled)  
     
     
         28 . (canceled)  
     
     
         29 . A method for fabricating a flexible RF ID device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible RF ID device, said flexible substrate having a bottom surface which comprises a conductive region, said openings exposing at least a portion of said conductive region;    filling said openings with a conductive material which makes electrical contact to at least a portion of said conductive region, said conductive material also for making electrical contact to electrical components on said top surface.    
     
     
         30 . A method as in  claim 29  further comprising: 
 patterning said conductive region, wherein said patterning forms a plurality of conductors from said conductive region; and wherein each of said openings is electrically coupled to at least one of said plurality of conductors.    
     
     
         31 . A method as in  claim 30  wherein said electrical components comprise at least an integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         32 . A method as in  claim 29  wherein said conductive region constitutes at least 10% of a thickness of said flexible substrate.  
     
     
         33 . A method for fabricating a flexible RF ID device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible electronic device, said flexible substrate having a plurality of conductors disposed below said top surface, said openings exposing at least a portion of said plurality of conductors;    filling said openings with a conductive material which makes electrical contact to at least a portion of said plurality of conductors, said conductive material also for making electrical contact to electrical components on said top surface.    
     
     
         34 . A method as in  claim 33  wherein said electrical components comprise at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         35 . A method as in  claim 33  wherein said plurality of conductors constitutes at least 10% of a thickness of said flexible substrate.  
     
     
         36 . A method for fabricating a flexible electronic device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible electronic device, said flexible substrate having a bottom surface which comprises a conductive region, said openings exposing at least a portion of said conductive region;    filling said openings with a conductive material which makes electrical contact to at least a portion of said conductive region, said conductive material also for making electrical contact to electrical components on said top surface.    
     
     
         37 . A method as in  claim 36  wherein said conductive region constitutes at least 10% of a thickness of said flexible substrate.  
     
     
         38 . A method as in  claim 36  further comprising: 
 patterning said conductive region, wherein said patterning forms a plurality of conductors from said conductive region; and wherein each of said openings is electrically coupled to at least one of said plurality of conductors.    
     
     
         39 . A method as in  claim 36  wherein said electrical components comprise at least (a) an integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate; and (b) a passive electronic component.  
     
     
         40 . A method as in  claim 38  wherein said plurality of conductors constitutes at least 10% of a thickness of said flexible substrate.  
     
     
         41 . A method for fabricating a flexible electronic device, said method comprising: 
 forming openings in a top surface of a flexible substrate which forms a part of a flexible electronic device, said flexible substrate having a plurality of conductors disposed below said top surface, said openings exposing at least a portion of said plurality of conductors;    filling said openings with a conductive material which makes electrical contact to at least a portion of said plurality of conductors, said conductive material also for making electrical contact to electrical components on said top surface.    
     
     
         42 . A method as in  claim 41  wherein said electrical components comprise at least one passive electronic component and at least one integrated circuit, fabricated in a first rigid substrate and deposited onto a region of said flexible substrate.  
     
     
         43 . A method as in  claim 41  wherein said plurality of conductors constitutes at least 10% of a thickness of said flexible substrate.