Alignment of fiber optic bundle to array waveguide using pins

Abstract

A device and method for aligning a fiber optic bundle with an array waveguide uses pins that partially extend into both the fiber optic bundle and the array waveguide to achieve course alignment. In one embodiment, the pins are inserted into holes formed by V-grooves in the fiber optic bundle. Finely aligning the fiber optic bundle and the array waveguide may be done by manual adjustment.

1 - 15 . (canceled)  
   
   
       16 . A device comprising: 
 a fiber optic bundle having a termination block;    an array waveguide positioned adjacent to the termination block;    pins each partially extending into both the termination block and the array waveguide; and    a cured epoxy that bonds the termination block to the array waveguide.    
   
   
       17 . The device of  claim 16 , wherein the termination block comprises two silicon substrates having etched grooves in them, and the pins partially extend into holes formed by placing the two etched silicon substrates together.  
   
   
       18 . The device of  claim 16 , wherein the pins partially into etched recesses in the array waveguide.  
   
   
       19 . A method comprising: 
 inserting one or more selected from pins, rods, and dowels, into one or more holes formed in both a fiber optic bundle and an array waveguide; pressing the fiber optic bundle and the array waveguide together so that the one or more selected from the pins, rods, and dowels, extend into both the fiber optic bundle and the array waveguide;    applying an epoxy to bond the fiber optic bundle to the array waveguide; and    curing the epoxy.    
   
   
       20 . The method of  claim 19 , further comprising, prior to said curing the epoxy, finely aligning optical fibers in the fiber optic bundle with channels of the array waveguide.  
   
   
       21 . The method of  claim 20 , wherein said finely aligning the optical fibers in the fiber optic bundle with the channels of the array waveguide comprises performing manual adjustment.  
   
   
       22 . The method of  claim 19 , wherein said inserting the one or more selected from the pins, rods, and dowels, into the one or more holes formed in the fiber optic bundle comprises inserting the one or more selected from the pins, rods, and dowels, into one or more holes formed by placing two etched substrates together.  
   
   
       23 . The method of  claim 19 , wherein said inserting the one or more selected from the pins, rods, and dowels, into the one or more holes formed in the array waveguide comprises inserting the one or more selected from the pins, rods, and dowels, into one or more etched holes in the array waveguide.  
   
   
       24 . A method comprising: 
 coarsely aligning a fiber optic bundle with an array waveguide by: 
 inserting pins into holes formed in an end of a fiber optic bundle;  
 inserting opposite ends of the pins into an array waveguide; and  
 pressing the fiber optic bundle and the array waveguide together; and  
   finely aligning the fiber optic bundle with the array waveguide after said coarsely aligning the fiber optic bundle with the array waveguide.    
   
   
       25 . The method of  claim 24 , further comprising: 
 applying an epoxy between the fiber optic bundle and the array waveguide; and    after said finely aligning, curing the epoxy to bond the fiber optic bundle and the array waveguide.    
   
   
       26 . The method of  claim 24 , wherein said inserting the pins into the holes formed in the end of the fiber optic bundle comprises inserting the pins into holes formed by placing two etched substrates together.  
   
   
       27 . The method of  claim 24 , wherein said inserting the opposite ends of the pins into the array waveguide comprises inserting the ends of the pins into etched holes in the array waveguide.  
   
   
       28 . A method comprising: 
 providing an array waveguide having a material located in positions corresponding to recesses to accommodate pins where the material is different than other materials of the array waveguide; and    selectively removing the material to form the recesses to accommodate the pins.    
   
   
       29 . The method of  claim 28 , wherein said selectively removing the material comprises selectively etching the material.  
   
   
       30 . The method of  claim 28 , further comprising introducing pins into both the recesses and into holes in a fiber optic bundle.  
   
   
       31 . A method comprising: 
 placing optical fibers in etched grooves in a first silicon substrate;    placing a second silicon substrate having etched grooves therein such that the optical fibers are sandwiched between the etched grooves of the first and second silicon substrates and such that other etched grooves of the first and second silicon substrates form holes.    
   
   
       32 . The method of  claim 31 , further comprising inserting pins into the holes.  
   
   
       33 . The method of  claim 31 , further comprising etching the other etched grooves of the first and second silicon substrates.