US2005180216A1PendingUtilityA1

Phase change access device for memories

Priority: Aug 4, 2003Filed: Apr 11, 2005Published: Aug 18, 2005
Est. expiryAug 4, 2023(expired)· nominal 20-yr term from priority
Inventors:Tyler Lowrey
G11C 13/0007G11C 2213/76G11C 2213/32G11C 2213/71G11C 13/003G11C 13/0004G11C 13/02G11C 11/34H10B 63/24H10N 70/826H10B 63/84H10N 70/231H10N 70/063H10N 70/8828H10N 70/882H10N 70/20
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Claims

Abstract

A memory may have access devices formed using a chalcogenide material. The access device does not induce a snapback voltage sufficient to cause read disturbs in the associated memory element being accessed. In the case of phase change memory elements, the snapback voltage may be less than the threshold voltage of the phase change memory element.

Claims

exact text as granted — not AI-modified
1 . A method comprising: 
 forming a chalcogenide access device having a snapback voltage low enough to avoid disturbing data stored in a memory element while reading the memory element selected by the access device.    
     
     
         2 . The method of  claim 1  including forming the chalcogenide access device to have a snapback voltage less than the threshold voltage of the memory element.  
     
     
         3 . The method of  claim 2  including forming the memory element of a phase change material.  
     
     
         4 . The method of  claim 2  including forming the memory element of a thin film material.  
     
     
         5 . The method of  claim 1  including forming at least two arrays of memory elements stacked one on top of the other.  
     
     
         6 . The method of  claim 5  including forming memory arrays with at least two memory elements each having a chalcogenide access device.  
     
     
         7 . The method of  claim 6  including forming said chalcogenide access devices above a semiconductor substrate.  
     
     
         8 . The method of  claim 7  including forming said memory elements above said semiconductor substrate.  
     
     
         9 . The method of  claim 8  including forming an access device over a memory element.  
     
     
         10 . The method of  claim 9  including forming the access device directly on top of the memory element without an intervening barrier layer.  
     
     
         11 - 31 . (canceled)

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