Low thermal stress composite heat sink assembly

Abstract

A heat sink assembly is presented for dissipating heat from one or more electronic components. The heat sink assembly may have a heat-dissipating substrate and one or more heat-dissipating studs, such that the one or more heat-dissipating studs may be within the heat-dissipating substrate such that the one or more electronic components may be attached to the one or more heat-dissipating studs.

1 . An heat sink device for dissipating heat from an electronic component, the heat sink device comprising: 
 an heat-dissipating substrate having one or more apertures; and    one or more heat-dissipating studs attached within said one or more apertures within said heat-dissipating substrate such that the electronic component may be attached to the heat-dissipating stud.    
   
   
       2 . The application specific heat sink device in accordance with  claim 1 , wherein said one or more apertures in said heat-dissipating substrate extend from a first side to a second side of said heat-dissipating substrate.  
   
   
       3 . The application specific heat sink device in accordance with  claim 1 , wherein said one or more apertures in said heat-dissipating substrate are cylindrical, conical or stepped.  
   
   
       4 . The application specific heat sink device in accordance with  claim 1 , wherein said one or more apertures in said heat-dissipating substrate are pyramidal.  
   
   
       5 . The application specific heat sink device in accordance with  claim 1 , wherein the heat-dissipating substrate includes fins.  
   
   
       6 . The application specific heat sink device in accordance with  claim 1 , wherein the heat-dissipating stud comprises a material with a CTE relatively close to the CTE of the electronic component to be cooled.  
   
   
       7 . The application specific heat sink device in accordance with  claim 1 , wherein the heat-dissipating stud comprises a material with a CTE relatively intermediate between the CTE of the electronic component to be cooled and the heat-dissipating substrate.  
   
   
       8 . The application specific heat sink device in accordance with  claim 1 , wherein the heat-dissipating stud comprises a metal, a metal alloy or combinations thereof.  
   
   
       9 . A method for manufacturing an heat sink device, comprising: 
 forming a heat-dissipating substrate with one or more apertures extending from a first surface to a second surface of the heat-dissipating substrate;    forming one or more heat-dissipating studs, wherein the one or more heat-dissipating studs are shaped and sized to mate within the aperture in the heat-dissipating substrate, extending from one side to the other of the aperture and mate with an electronic device to be cooled on one side of the aperture; and    attaching the heat-dissipating stud within the aperture of the substrate.    
   
   
       10 . The method in accordance with  claim 9 , wherein the heat-dissipating stud comprises a material selected to have a relatively close CTE with the electronic device to be cooled.  
   
   
       11 . The method in accordance with  claim 9 , wherein the heat-dissipating stud comprises a material selected to have an intermediate CTE between the heat-dissipating substrate and a device to be cooled.  
   
   
       12 . The method in accordance with  claim 9 , further comprising the step of forming a cavity in a top surface of the heat-dissipating substrate; wherein the heat-dissipating stud is attached within the cavity formed on the heat-dissipating substrate.  
   
   
       13 . The method in accordance with  claim 9 , wherein the heat-dissipating substrate includes fins.