Global network computers

Abstract

Embodiments useful for a network of computers are presented. In an embodiment, a microchip includes a plurality of dies. Each die is made by a separate fabrication process and assembled into a package with the separate die sections connected directly.

1 . A microchip comprising: 
 a plurality of dies, each made by a separate fabrication process and assembled into a package with the separate die sections connected directly.    
     
     
         2 . The microchip according to  claim 1 , wherein the separate die sections are connected by interconnects that are widened compared to the circuits of the die.