US2005179128A1PendingUtilityA1
Semiconductor device with capacitor
Est. expiryJul 18, 2022(expired)· nominal 20-yr term from priority
H10W 90/756H10W 90/734H10W 90/728H10W 90/724H10W 74/15H10W 74/00H10W 72/07236H10W 72/951H10W 72/551H10W 72/075H10W 70/681H10W 74/111H10W 44/601H10W 72/00H10D 86/85H05K 2201/10734H05K 2201/10515H05K 2201/1053H05K 1/182H05K 1/0231
46
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Claims
Abstract
A semiconductor device comprises a carrier substrate, an integrated circuit chip mounted on the carrier substrate via bumps, and a capacitor provided to stabilize operation of the integrated circuit chip at high frequencies. In the semiconductor device, the capacitor is electrically connected to pads on bottom of the integrated circuit chip, and the capacitor is provided to have a height on the carrier substrate that is smaller than or equal to a height of the bumps on the carrier substrate.
Claims
exact text as granted — not AI-modified1 - 2 . (canceled)
3 . A semiconductor device comprising:
a carrier substrate; an integrated circuit chip mounted on the carrier substrate; a capacitor provided to stabilize operation of the integrated circuit chip at high frequencies; and a lead frame provided on the carrier substrate and electrically connected to the integrated circuit chip through a wire, wherein the capacitor is electrically connected to pads on the integrated circuit chip, and the capacitor is provided to have a height on the integrated circuit chip that is smaller than a height of the wire on the integrated circuit chip.
4 - 9 . (canceled)
10 . The semiconductor device of claim 3 further comprising a resin mold, the capacitor being enclosed in the resin mold.Join the waitlist — get patent alerts
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