Methods for fabrication of a polishing article

Abstract

Methods are provided for forming a conductor for use in electrochemical mechanical polishing. In one aspect a method is provided for processing a substrate including providing a substrate having a conductive surface, depositing a resist material on the conductive surface, patterning the resist layer to expose portions of the conductive surface, and depositing a metal layer on the exposed portions of the conductive surface by an electrochemical deposition technique.

1 . A method for processing a polishing article, comprising: 
 providing a substrate having a conductive base structure comprising one or more fibers coated with a conductive material;    depositing a mask material on the conductive base structure;    patterning the mask layer to expose portions of the conductive base structure; and    depositing a metal layer on the exposed portions of the conductive base structure by an electrochemical deposition technique.    
     
     
         2 . The method of  claim 1 , wherein the metal is selected from the group consisting of tin, copper, nickel, tungsten, molybdenum, cobalt, ruthenium, titanium, zirconium, hafnium, niobium, tantalum, vanadium, chromium, manganese, iron, palladium, platinum, aluminum, and combinations thereof.  
     
     
         3 . The method of  claim 1 , wherein the metal comprises tin or a tin alloy.  
     
     
         4 . The method of  claim 1 , wherein the electrochemical deposition technique comprises electroplating or electroless deposition.  
     
     
         5 . The method of  claim 1 , wherein the conductive base structure comprises a fabric layer.  
     
     
         6 . The method of  claim 5 , wherein the fabric layer comprises a woven conductive fiber material or a woven dielectric fiber material at least partially covered with a conductive material.  
     
     
         7 . The method of  claim 6 , wherein the conductive material is selected from the group consisting of gold, tin, palladium, palladium-tin alloys, platinum, copper, nickel, lead, and metal alloys and ceramic composites softer than copper.  
     
     
         8 . The method of  claim 7 , wherein the conductive material comprises tin or a tin alloy.  
     
     
         9 . The polishing article of  claim 6 , further comprising a conductive seed layer disposed on the woven conductive fiber material or the woven dielectric fiber material prior to deposition of the conductive material.  
     
     
         10 . The method of  claim 1 , wherein the conductive base structure further comprises a plurality of perforations formed therethrough.  
     
     
         11 . The method of  claim 1 , further comprising a window disposed through the base structure.  
     
     
         12 . A polishing article for processing a substrate, comprising: 
 a base structure including at least a fabric layer; and    a plurality of conductive contacts disposed on the fabric layer and adapted to polish a substrate.    
     
     
         13 . The polishing article of  claim 12 , wherein the fabric layer further comprises a woven material comprising a conductive material, a dielectric material at least partially covered with a conductive material, or both.  
     
     
         14 . The polishing article of  claim 12 , wherein the conductive material is selected from the group consisting of conductive carbon materials, gold, tin, palladium, palladium-tin alloys, platinum, lead, and metal alloys and ceramic composites softer than copper, and the dielectric material comprises polymeric fibers selected from the group of polyamides, nylon polymer, polyurethane, polyester, polypropylene, polyethylene, polycarbonate, diene containing polymers, polystyrene, polyacrylontrile ethylene styrene, acrylic polymers, and combinations thereof, and the conductive material comprises a metal, carbon material, a conductive ceramic material, a metal inorganic material, or combinations thereof.  
     
     
         15 . The polishing article of  claim 14 , further comprising a conductive seed layer disposed on the dielectric material before the conductive material.  
     
     
         16 . The polishing article of  claim 14 , wherein the conductive material is tin and the dielectric material comprises nylon or polyester.  
     
     
         17 . The polishing article of  claim 12 , wherein the conductive layer further comprises an embossed upper surface, a plurality of perforations formed therethrough, a window disposed through the conductive layer and the fabric layer, or a combination thereof.  
     
     
         18 . The polishing article of  claim 12 , wherein the base structure further includes a non-conductive material.  
     
     
         19 . The polishing article of  claim 18 , wherein the base structure comprises a central portion comprising the fabric material and an outer portion comprising a non-conductive material.  
     
     
         20 . A method for processing a polishing article, comprising: 
 providing a substrate having a conductive base structure comprising one or more fibers coated with a conductive material;    depositing a pattern template on the conductive base structure, wherein the patterned template is adapted to expose portions of the conductive base structure; and    depositing a metal layer on the exposed portions of the conductive base structure by an electrochemical deposition technique.