Structure for expanding thermal conducting performance of heat sink

Abstract

A structure for expanding thermal conducting performance of a heat sink includes a bottom plate, a top plate, a hollow filling tube, a wick structure and a hollow thermal expansion conductor. The top and bottom plates are covered with each other to form a planar shell, in which an upper receiving chamber and a lower receiving chamber are formed. The wick structure is attached to the planar shell in upper and lower receiving chambers. The filling tube is filled with a working fluid. The thermal conductor has good conducting performance and is embedded in the planar shell. Further, the thermal conductor is in fluid communication with the upper and the lower chamber, such that the thermal conductor can serve as an extension of the planar shell for heat dissipation.

1 . A structure for expanding thermal conduction performance of a heat sink, comprising: 
 a bottom plate, having a bottom receiving chamber recessed from a top surface thereof;    a top plate, having a top receiving chamber recessed from a bottom surface thereof, wherein the top and bottom receiving chambers are aligned with each other, and the top plate and the bottom plate are covered by each other to form a planar shell, wherein the top and bottom receiving chambers are filled with work fluid;    a hollow filling tube embedded in a sidewall of the planar shell, the hollow filling tube being in fluid communication with the top and bottom receiving chambers, the filling tube has one sealed end distal to the planar shell;    a wick structure attached to the top and bottom plates within the top and bottom receiving chambers; and    at least one hollow thermal expansion conductor, wherein one end of the thermal expansion conductor is inserted into the planar shell, and the other end thereof extends outside of the planar shell, such that the thermal expansion conductor is in fluid communication with the top and bottom receiving chambers.    
   
   
       2 . The structure as claimed in  claim 1 , further comprising a plurality of supporting columns extending from the top surface of the bottom plate to the bottom surface of the top plate.  
   
   
       3 . The switch as claimed in  claim 1 , wherein the thermal expansion conductor includes a heat plate.  
   
   
       4 . The structure as claimed in  claim 1 , wherein the thermal expansion conductor includes a columnar heat pipe.  
   
   
       5 . The structure as claimed in  claim 1 , wherein the thermal expansion conductor includes a tubular heat pipe.  
   
   
       6 . The structure as claimed in  claim 5 , further comprising a plurality of fins through which the tubular heat pipe penetrate through.  
   
   
       7 . The structure as claimed in  claim 1 , wherein a proximal end of the thermal expansion conductor is embedded in the planar shell between the top and bottom plates, and the other end thereof extends outside of the planar shell.  
   
   
       8 . The structure as  claim 1 , wherein the thermal expansion conductor is at least partially embedded in the bottom plate.  
   
   
       9 . The structure as  claim 1 , wherein the thermal expansion conductor is at least partially embedded in the top plate.