Cooling system or electronic apparatus, and electronic apparatus using the same

Abstract

An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming/extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.

1 . A cooling system for an electronic apparatus, installing a semiconductor element within a housing, which necessitates cooling for maintaining normal operation thereof, in a part of the housing, having: 
 a heat diffusion element being connected with the semiconductor element, thermally, wherein said heat diffusion element comprises:    a plate-like member of heat conductive material, enclosing therein an operating liquid having large latent heat; and    an actuator being provided in a part of the plate-like member, for vibrating said operating liquid having large latent heat, wherein:    said heat diffusion element mounts said heat-generating semiconductor element on one side surface, while transporting heat generated from said heat-generation semiconductor element to other side surface of said heat diffusion element, thereby conducting heat transmission from said other side surface.    
   
   
       2 . The cooling system for an electronic apparatus, as described in the  claim 1 , wherein a heat radiation plate is attached on the other side surface of said heat diffusion element.  
   
   
       3 . The cooling system for an electronic apparatus, as described in the  claim 1 , wherein a cooling jacket is attached on the other side surface of said heat diffusion element, being thermally connected with said semiconductor element, thereby transmitting the heat generated therein to a liquid coolant vibrating within an inside of said cooling jacket, so as to conduct the cooling upon said semiconductor.  
   
   
       4 . The cooling system for an electronic apparatus, as described in the  claim 1 , wherein the actuator for vibrating the operating liquid filled within said heat diffusion element is made up with a heater wire wound around periphery of two (2) pieces of supporting bodies.  
   
   
       5 . The cooling system for an electronic apparatus, as described in the  claim 4 , wherein said heater wire is made from a nichrome wire.  
   
   
       6 . The cooling system for an electronic apparatus, as described in the  claim 4 , wherein said actuator made up with the heater wire wound around the periphery of said two (2) pieces supporting bodies is disposed within an inside of said plate-like member, so that it dips in said operating fluid filled therein, near to said other surface thereof.  
   
   
       7 . The cooling system for an electronic apparatus, as described in the  claim 4 , wherein hydrophilic treatment is conducted on a portion, on a surface of interior wall of said one side surface in said plate-like member, in vicinity of said actuator.  
   
   
       8 . An electronic apparatus, installing a heat-generating semiconductor element within a housing thereof, which requires cooling for maintaining normal operation there, and having a cooling system, within said housing or in a part thereof, comprising: 
 a cooling jacket, being thermally connected with the semiconductor element, for transmitting heat generated from to a liquid coolant flowing within an inside thereof;    a radiator ford is charging the heat transmitted to the liquid coolant in said cooling jacket into an outside; and    a circulation pump for circulating said liquid coolant in a loop, including said cooling jacket and said radiator therein, wherein:    said cooling jacket is in contact with a surface of said heat-generating semiconductor element through a heat diffusion means for diffusing the heat generated from said heat-generating semiconductor element.    
   
   
       9 . The electronic apparatus descried in the  claim 8 , wherein said heat diffusion means for diffusing the heat generated from said heat-generating semiconductor element into said cooling jacket comprises a hermetically sealed space for enclosing an operating fluid having large latent heat to be vibrated within an inside thereof, and is made up with a plate-like member having a surface shape being almost similar to that of said cooling jacket and being superior in heat conductivity, wherein an actuator is provided in a portion thereof, for vibrating said operating fluid, while dipping in said operating fluid.  
   
   
       10 . The electronic apparatus descried in the  claim 9 , wherein in a part of said hermetically sealed space of said heat diffusion means, into an inside of which is enclosed the operating fluid having the large latent heat to be vibrated, is provided a buffer portion for enclosing a gas therein.  
   
   
       11 . The electronic apparatus descried in the  claim 10 , wherein said hermetically sealed space of said heat diffusion means, into an inside of which is enclosed the operating fluid having the large latent heat to be vibrated, are formed in a plural number thereof and in parallel with each other, and also each of those is connected through said buffer portion, thereby forming a comb-like shape.  
   
   
       12 . The electronic apparatus descried in the  claim 9 , wherein said heat diffusion means comprises a heating means provided in contact with a part of the operating fluid enclosed within said hermetically sealed space, and said heating means is supplied with pulse-like electric power, thereby providing vibration to said operating fluid.  
   
   
       13 . An electronic apparatus, installing a heat-generating semiconductor element within a housing thereof, which requires cooling for maintaining normal operation there, and having a cooling system, within said housing or in a part thereof, comprising: 
 a heat diffusion element, being connected with said semiconductor element, thermally; and    a heat radiator, wherein said heat diffusion element comprises:    a plate-like member of heat conductive material, enclosing therein an operating liquid having large latent heat; and    an actuator being provided in a part of the plate-like member, for vibrating said operating liquid having large latent heat, whereby said heat diffusion element mounts said heat-generating semiconductor element on one side surface, while diffusing heat generated from said heat-generating semiconductor element, thereby transmitting the heat to the other side surface of said heat diffusion element; and    said heat radiation plate is attached on the other side surface of said heat diffusion element, and transmitting the heat generated from said heat-generating semiconductor element, which is transported through said heat diffusion element, from a surface thereof into an outside.