Package structure of optical device and method for manufacturing the same

Abstract

A package structure of optical device has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has an optical device and a plurality of chip connection pads. The sealant is disposed around the optical elements. The cover is disposed on the sealant. The substrate supports the chip and has a plurality of connection pads. The bonding wires are used for electrically connecting the chip connection pads of the chip to the connection pads of the substrate. The transparent encapsulant is formed over the substrate and the cover, and encapsulates the bonding wires.

1 . A package structure of optical device, comprising: 
 a chip, having an optical device and a plurality of chip connection pads;    a sealant, disposed around the optical device;    a cover, disposed on the sealant;    a substrate, supporting the chip and having a plurality of first connection pads;    a plurality of bonding wires, electrically connecting the chip connection pads of the chip to the first connection pads of the substrate; and    a transparent encapsulant, formed over the substrate and the cover, and packaging the bonding wires.    
   
   
       2 . The package structure of optical device of  claim 1 , wherein the substrate further comprises a plurality of second connection pads, electrically connected to the first connection pads for connecting to an external circuit apparatus.  
   
   
       3 . The package structure of optical device of  claim 2 , wherein the substrate further comprises a plurality of circuit lines, used to electrically connect the first connection pads to the second connection pads.  
   
   
       4 . The package structure of optical device of  claim 1 , wherein the cover is an optical filtering plate.  
   
   
       5 . The package structure of optical device of  claim 1 , wherein the cover is a lens.  
   
   
       6 . The package structure of optical device of  claim 1 , wherein the sealant includes a plurality of spacers, so as to maintain the cover to have a uniform spacing to the chip.  
   
   
       7 . A fabrication method for a package structure of optical device, comprising: 
 providing a wafer, having a plurality of chips, and each of the chips having an optical device and a plurality of chip connection pads, and a plurality of first cutting lines for separating the chips;    dispensing a sealant to each of the chips on the wafer, and enclosing the optical device;    providing a cover substrate, having a plurality of covers, each of the covers is corresponding to the optical device of the chips and a plurality of second cutting lines, used for separating the covers;    aligning the cover substrate with the wafer, and disposing the cover substrate on the wafer;    curing the sealant;    cutting the wafer and the cover substrate along the first scribe lines and the second scribe lines, so as to form a plurality of pre-package structures;    providing a substrate strip, having a plurality of substrates, wherein each of the substrates has a plurality of first connection pads;    affixing the pre-package structures to the substrates;    electrically connecting the chip connection pads of the chips to the substrates by a plurality of bonding wires;    molding an encapsulant over the substrates, so as to package the bonding wires; and    cutting the substrates and the encapsulant, for forming the package structure of optical device.    
   
   
       8 . The fabrication method of  claim 7 , wherein each of the substrates further includes a plurality of second connection pads, electrically connected to the first connection pads, so as to be connected to an external circuit apparatus.  
   
   
       9 . The fabrication method of  claim 8 , wherein each of the substrates further includes a plurality of circuit lines, so as to electrically connect the first connection pads to the second connection pads.  
   
   
       10 . The fabrication method of  claim 7 , wherein the cover is an optical filtering plate.  
   
   
       11 . The fabrication method of  claim 7 , wherein each of the covers is a lens.  
   
   
       12 . The fabrication method of  claim 7 , wherein the sealant provides a plurality of spacers, so as to maintain a uniform spacing between the covers and the chips.  
   
   
       13 . The fabrication method of  claim 7 , wherein in the step of respectively cutting the wafer and the cover substrate to form the pre-package structures, the wafer and the cover substrate are cut along the first cutting lines and the second cutting lines but not cut through.  
   
   
       14 . The fabrication method of  claim 13 , wherein the step of respectively cutting the wafer and the cover substrate for forming the pre-package structures further comprises a breaking process to form the pre-package structures.  
   
   
       15 . The fabrication method of  claim 7 , wherein in the step of respectively cutting the wafer and the cover substrate to form the pre-package structures, the wafer and the cover substrate are cut along the first cutting lines and the second cutting lines to form a plurality of grooves thereon.  
   
   
       16 . The fabrication method of  claim 15 , wherein the step of respectively cutting the wafer and the cover substrate for forming the pre-package structures further comprises a breaking process to form the pre-package structures.  
   
   
       17 . A package structure of optical device, comprising: 
 a chip, having an optical device and a plurality of connection pads;    a sealant, disposed around the optical device; and    a cover, disposed over the sealant.    
   
   
       18 . The package structure of  claim 16 , wherein the cover is an optical filtering plate.  
   
   
       19 . The package structure of  claim 16 , wherein the cover is a lens.  
   
   
       20 . The package structure of  claim 16 , wherein the sealant provides a plurality of spacers, so as to maintain a uniform spacing between the covers and the chips.  
   
   
       21 . A fabrication method for a package structure of optical device, comprising the steps of: 
 providing a wafer, having a plurality of chips, each of the chips having an optical device and a plurality of chip connection pads, and a plurality of first cutting lines for separating the chips;    dispensing a sealant on the chips of the wafer around the optical device;    providing a cover substrate, having a plurality of covers, wherein each of the covers is corresponding to the optical device, and a plurality of second cutting lines for separating the covers;    aligning the cover substrate with the wafer, and disposing the cover substrate over the wafer;    curing the sealant;    cutting the wafer and the cover substrate along the first cutting lines and the second cutting lines, for forming the package structure of optical device.    
   
   
       22 . The fabrication method of  claim 20 , wherein each of the covers is an optical filtering plate.  
   
   
       23 . The fabrication method of  claim 20 , wherein each of the covers is a lens.  
   
   
       24 . The fabrication method of  claim 20 , wherein the sealant provides a plurality of spacers, so as to maintain a uniform spacing between the covers and the chips.  
   
   
       25 . The fabrication method of  claim 20 , wherein in the step of cutting the wafer and the cover substrate along the first cutting lines and the second cutting lines for forming the package structure of optical device, the wafer and the cover substrate are not cut through.  
   
   
       26 . The fabrication method of  claim 25 , wherein the step of cutting the wafer and the cover substrate for forming the package structure of optical device further comprises a breaking process to form the package structures.  
   
   
       27 . The fabrication method of  claim 20 , wherein in the step of cutting the wafer and the cover substrate along the first cutting lines and the second cutting lines for forming the package structure of optical device, the wafer and the cover substrate are cut to form a plurality of grooves thereon.  
   
   
       28 . The fabrication method of  claim 27 , wherein the step of cutting the wafer and the cover substrate for forming the package structure of optical device further comprises a breaking process to form the package structures.