Plasma generating apparatus and plasma processing apparatus
Abstract
Provided is a microwave plasma generating apparatus using a multiple open-ended cavity resonator, and a plasma processing apparatus including the microwave plasma generating apparatus. The plasma processing apparatus includes a container for forming a process chamber, a support unit that supports a material to be processed in the process chamber, a dielectric window formed on an upper part of the process chamber, a gas supply unit that inject a process gas into the process chamber, and a microwave supply unit that includes a plurality of resonators for supplying microwaves through the dielectric window.
Claims
exact text as granted — not AI-modified1 . A plasma processing apparatus comprising:
a container for forming a process chamber; a support unit that supports a material to be processed in the process chamber; a dielectric window formed on an upper part of the process chamber; a gas supply unit that inject a process gas into the process chamber; and a microwave supply unit that includes a plurality of open ended cavity resonators for supplying microwaves through the dielectric window.
2 . The plasma processing apparatus of claim 1 , wherein the gas supply unit comprises:
an upper gas supply unit mounted through the center of the dielectric window; a first gas supply unit for supplying the process gas to a surface of the material to be processed at a predetermined angle; and a second gas supply unit configured to have a radially uniform distribution of gas flux.
3 . The plasma processing apparatus of claim 2 , wherein gas flux through each of the gas supply units is independently controlled.
4 . The plasma processing apparatus of claim 1 , wherein the plurality of open-ended cavity resonators are open at portions contacting the dielectric window.
5 . The plasma processing apparatus of claim 1 , wherein the microwave supply unit comprises:
a microwave power source for generating microwaves; a plurality of waveguides; a coupler for distributing the microwaves generated by the microwave power source to the plurality of waveguides; and a plurality of open ended cavity resonators connected to a plurality of waveguides, respectively.
6 . The plasma processing apparatus of claim 5 , wherein radial plasma uniformity in the process chamber can be improved by changing a ratio of microwave power transmitted to each of the waveguides.
7 . The plasma processing apparatus of claim 5 , wherein each of the waveguides are capable of rotation with respect to an axis of the process chamber.
8 . The plasma processing apparatus of claim 5 , wherein the plurality of waveguides are configured to be co-axial.
9 . The plasma processing apparatus of claim 5 , wherein adjacent waveguides share a common wall.
10 . The plasma processing apparatus of claim 1 , wherein the supporting means is able to move up and down to locate a substrate loaded on the supporting means at a level of optimum plasma uniformity.
11 . A microwave supply unit comprising:
a microwave power source for generating microwaves; a plurality of waveguides; a coupler for distributing the microwaves generated by the microwave power source to the plurality of waveguides; and a plurality of resonators.
12 . The microwave supply unit of claim 11 , wherein the coupler adjusts a ratio of microwave power transmitted to each of the waveguides.
13 . The microwave supply unit of claim 11 , wherein the waveguides are capable of rotation with respect to each other.
14 . The microwave supply unit of claim 11 , wherein portions of the plurality of open-ended cavity resonators opposite to the waveguides are open.
15 . The microwave supply unit of claim 11 , wherein the plurality of waveguides are configured co-axially.
16 . The microwave supply unit of claim 11 , wherein adjacent waveguides share a common wall.Join the waitlist — get patent alerts
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