Method for processing an electronic part

Abstract

Disclosed is a gas-generating, pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation, and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation, wherein the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitate release of the adherend from the gas-generating, pressure-sensitive adhesive composition.

1 . A method for processing an electronic part, comprising: 
 (1) applying a gas-generating, pressure-sensitive adhesive reagent to a surface of a substratum to provide a gas-generating, pressure-sensitive adhesive hybrid, wherein said gas-generating, pressure-sensitive adhesive reagent generates a gas upon irradiation thereof with a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation, and wherein said substratum transmits said irradiation;    (2) securely attaching one surface of an electronic part onto a gas-generating, pressure-sensitive adhesive reagent-side surface of said gas-generating, pressure-sensitive adhesive hybrid, wherein the other surface of said electronic part is left exposed;    (3) working said exposed surface of the electronic part;    (4) irradiating said gas-generating, pressure-sensitive adhesive reagent with said radiation through said substratum, to thereby cause said pressure-sensitive adhesive reagent to generate a gas, so that the gas effuses at an interface between said gas-generating, pressure-sensitive adhesive reagent and said electronic part; and    (5) detaching said electronic part from said adhesive hybrid.    
     
     
         2 . The method according to  claim 1 , wherein said adhesive reagent is a gas-generating, pressure-sensitive adhesive composition comprising: 
 a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation; and    a gas generator compound (B) which generates a gas upon irradiation thereof with said radiation,    said gas generator compound (B) being operably combined with said pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with said radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitates release of the adherend from the gas-generating, pressure-sensitive adhesive composition.    
     
     
         3 . The method according to  claim 2 , wherein said gas generator compound (B) is a compound having an azido group.  
     
     
         4 . The method according to  claim 3 , wherein said gas generator compound (B) is a compound having an organic azido group.  
     
     
         5 . The method according to  claim 4 , wherein said gas generator compound (B) is a compound having an azidomethyl group.  
     
     
         6 . The method according to  claim 2 , wherein said gas generator compound (B) is at least one compound selected from the group consisting of 3-azidomethyl-3-methyloxetane, 3,3′-bis(azidomethyl)oxetane and a glycidyl azide polymer.  
     
     
         7 . The method according to  claim 2 , wherein said adhesive (A) comprises at least one compound selected from the group consisting of a rubber polymer, an acrylic polymer, a polyether, a polyester, a polyisocyanate and a polyurethane.  
     
     
         8 . The method according to  claim 7 , wherein said adhesive (A) further comprises a photopolymerizable oligomer.  
     
     
         9 . The method according to  claim 8 , wherein said adhesive (A) is curable upon irradiation thereof with a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation.  
     
     
         10 . The method according to  claim 9 , wherein said radiation is an ultraviolet radiation.  
     
     
         11 . The method according to  claim 1 , wherein said gas-generating, pressure-sensitive adhesive reagent is a gas-generating, pressure-sensitive adhesive polymer which generates a gas upon irradiation thereof with a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation.  
     
     
         12 . The method according to  claim 11 , wherein said gas-generating, pressure-sensitive adhesive polymer is a glycidyl azide polymer.  
     
     
         13 . The method according to  claim 1 , wherein said pressure-sensitive adhesive hybride is an adhesive tape or sheet, comprising a substratum tape or sheet having applied thereto the adhesive reagent.  
     
     
         14 . The method according to  claim 13 , wherein said adhesive reagent has a thickness of from 0.005 to 1 mm.  
     
     
         15 . The method according to  claim 1 , wherein said radiation used in step (4) is an ultraviolet radiation.  
     
     
         16 . The method according to  claim 1 , wherein said electronic part is a precision electronic part.  
     
     
         17 . The method according to  claim 1 , wherein said electronic part is a substrate for an electronic appliance.  
     
     
         18 . The method according to  claim 1 , wherein said electronic part is a semiconductor part, and wherein the working in said step (3) is selected from the group consisting of (i) a grinding of said exposed surface of the semiconductor part, and (ii) a cutting of said semiconductor part in a thicknesswise direction thereof from said exposed surface of said semiconductor part.  
     
     
         19 . The method according to  claim 18 , wherein said semiconductor part is a semiconductor wafer.