Insert molding electronic devices

Abstract

An apparatus and methods are provided for housing an electronic device. In one embodiment, an electronic device is positioned on a housing base and a housing lid is over-molded onto at least a portion of the base and the electronic device. An interface of the electronic device remains exposed for coupling to a second electronic device, and the housing base and housing lid form a housing partially encasing the electronic device. In another embodiment, an inset panel can be formed within the housing lid or base, for example, by positioning the panel and the electronic device within a housing base and over-molding a housing lid, while maintaining the inset panel substantially exposed. The inset panel can be formed from a material of a contrasting color to provide, for example, a label region on the housed electronic device.

1 . A method of housing an electronic device, comprising: 
 positioning an electronic device on a base; and    over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device.    
   
   
       2 . The method of  claim 1 , wherein the electronic device is a thin walled semiconductor device.  
   
   
       3 . The method of  claim 1 , wherein the electronic device is a printed circuit board.  
   
   
       4 . The method of  claim 3 , wherein the printed circuit board is a flash memory module.  
   
   
       5 . The method of  claim 1 , further comprising: 
 adhering the electronic device to the base prior to over-molding the lid.    
   
   
       6 . The method of  claim 1 , wherein positioning an electronic device on a base comprises positioning the electronic device within a recess formed in the base.  
   
   
       7 . The method of  claim 1 , wherein the base includes one or more raised members and the electronic device includes one or more corresponding recesses, and wherein positioning the electronic device on the base comprises engaging the one or more raised members within the one or more recesses.  
   
   
       8 . The method of  claim 1 , wherein over-molding a lid comprises including an opening in the lid to provide access to an interface on the electronic device.  
   
   
       9 . The method of  claim 1 , wherein the base includes an opening to provide access to an interface on the electronic device.  
   
   
       10 . The method of  claim 9 , wherein over-molding a lid comprises including an opening to provide a second access to an interface on the electronic device.  
   
   
       11 . The method of  claim 1 , wherein the base is formed from a plastic material.  
   
   
       12 . The method of  claim 1 , wherein the lid is formed from a thermoplastic material.  
   
   
       13 . The method of  claim 12 , wherein the thermoplastic material is acrylonitrile butadiene styrene (ABS).  
   
   
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       27 . A method of housing an electronic device, comprising: 
 positioning an electronic device on a base;    positioning a panel on at least one of the base and the electronic device, the panel having a surface area less than the surface area of the base; and    over-molding a lid onto the base and at least a portion of the electronic device, wherein an upper surface of the panel remains substantially exposed.    
   
   
       28 . The method of  claim 27 , wherein the panel is formed by injection molding.  
   
   
       29 . The method of  claim 27 , wherein the panel is formed from a plastic material.  
   
   
       30 . The method of  claim 27 , wherein the panel is die-cut.  
   
   
       31 . The method of  claim 27 , further comprising adhering the panel to the base.  
   
   
       32 . The method of  claim 27 , further comprising adhering the panel to the electronic device.  
   
   
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