Method for manufacturing ceramic multilayer substrate

Abstract

The A ceramic multilayer substrate includes a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals vertically formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of one of the pattern layers, is connected to one of the external terminal terminals so as to exchange signals with the outside, and be is broad enough to surround at least partially the connected external terminal.

1 - 10 . (canceled)  
   
   
       11 . A method for manufacturing a ceramic multilayer substrate, comprising the steps of: 
 preparing ceramic substrates, each substrate having a designated thickness;    forming pattern layers on surfaces of the ceramic substrates so as to form circuit elements;    forming internal connection parts, each of which is formed on a part of the pattern layer, being connected to an edges of the ceramic substrates so as to exchange signals with the outside and having a width larger than the width of the connected pattern layers;    forming through holes on the edges of the ceramic substrates within areas of the internal connection parts, the through holes being semicircular in shape so as to be opened to the outside;    stacking a plurality of the ceramic substrates; and    forming an external terminal on the through holes of the stacked ceramic substrates so as to be electrically connected to the internal connection parts.    
   
   
       12 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 11 , wherein the internal connection parts are U-shaped so as to have an internal diameter smaller than a diameter of the semicircular through hole and an outer diameter greater than the diameter of the semicircular through hole.  
   
   
       13 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 11 , wherein the internal connection parts are separated from the side surfaces of the ceramic substrates adjacent to the through holes by a designated distance.  
   
   
       14 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 11 , wherein the internal connection parts are made of the same metallic materials as the pattern layers.  
   
   
       15 . A method for manufacturing a ceramic multilayer substrate, comprising the steps of: 
 preparing ceramic substrates, each substrate having a designated thickness;    forming pattern layers on a surface of each ceramic substrate so as to form circuit elements;    forming internal connection parts, each of which is formed on a part of the pattern layer, being separated from edges of the ceramic substrates by a designated distance so as to exchange signals with the outside and having a width larger than the width of the connected pattern layers;    forming through holes on the edges of the ceramic substrates within areas of the internal connection parts, the through holes being semicircular in shape so as to be opened to the outside;    stacking a plurality of the ceramic substrates so that a cavity is formed in an upper surface of the stacked ceramic substrates;    forming an external terminal on the through holes of the stacked ceramic substrates so as to be electrically connected to the internal connection parts; and    mounting electronic components within the cavity and installing a cover on the cavity so as to maintain a vacuum state within the cavity.    
   
   
       16 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 15 , wherein the electronic components are surface acoustic wave filter chips.  
   
   
       17 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 15 , wherein the internal connection parts are U-shaped so as to have an internal diameter smaller than a diameter of the semicircular through hole and an outer diameter greater than the diameter of the semicircular through hole.  
   
   
       18 . The method for manufacturing a ceramic multilayer substrate as set forth in  claim 15 , wherein the internal connection parts are made of the same metallic materials as the pattern layers.