Double-sided, edge-mounted stripline signal processing modules and modular network

Abstract

A class of modular, double-sided, edge-mounted printed circuit (PC) board modules and an associated modular network architecture for constructing stripline signal processing networks including high-power analog amplifiers and beam forming networks for driving multi-beam antenna systems. The stripline signal processing networks are characterized by network elements constructed from defined-length segments of transmission media configured to exhibit precisely determined phase and impedance characteristics. These circuits may also include conventional passive “lumped” electrical elements, such as resistors, capacitors and inductors; non-linear circuit elements such as diodes; and active electrical elements, such as amplifiers and transistors.

1 - 37 . (canceled)  
   
   
       38 . A signal processing module configured to perform a signal processing operation on signals propagating through the module, comprising: 
 a front-side microstrip circuit portion having a conductive printed circuit side exposed to air on a first side and exposed to a first dielectric substrate on an opposing side;    a back-side microstrip circuit portion having a conductive printed circuit side exposed to air on a first side and exposed to a second dielectric substrate on an opposing side; and    a ground plane sandwiched between the front-side and the back-side microstrip circuit portions.    
   
   
       39 . The signal processing module of  claim 38 , further comprising: 
 one or more tap-through connectors electrically connecting the printed circuit side of the front-side microstrip circuit portion to the printed circuit side of the back-side microstrip circuit portion;    the tap-through connectors extending through and electrically insulated from the ground plane; and    wherein the printed circuit sides of the front-side and back-side circuit portions, as connected by the tap-through connectors, form an integral double-sided microstrip circuit.    
   
   
       40 . The signal processing module of  claim 39 , wherein the integral double-sided microstrip circuit comprises an orthogonal signal processing network implementing a crossover defined by the printed circuit sides of the front-side and back-side circuit portions and the tap-through connectors.  
   
   
       41 . The signal processing module of  claim 40 , wherein the orthogonal signal processing network comprises a Butler matrix circuit signal processing network.  
   
   
       42 . The signal processing module of  claim 40 , wherein the orthogonal signal processing network implements a circuit selected from the group consisting of: 
 a two-by-four beam steering circuit;    a diplexer filter circuit comprising at least three ports;    a four-by-four Butler matrix circuit;    an eight-by-eight Butler matrix circuit; and    a monopulse comparator circuit.    
   
   
       43 . The signal processing module of  claim 42 , wherein: 
 the signal processing module defines an interface edge with one or more input ports and one or more output ports located at the interface edge; and    the integral double-sided microstrip circuit performs the signal processing operation on signals received by the at the input ports, propagating through the integral double-sided microstrip circuit and delivered to the output ports.    
   
   
       44 . A signal processing module configured to perform a signal processing operation on signals propagating through the module, comprising: 
 a first ground plane carried by a first dielectric substrate;    a front-side microstrip circuit portion having a conductive printed circuit side exposed to the dielectric substrate carried by the first ground plane on a first side, and having a dielectric material on an opposing side;    a second ground plane carried by a second dielectric substrate;    a back-side microstrip circuit portion having a conductive printed circuit side exposed to the dielectric substrate carried by the second ground plane on a first side, and having a dielectric material on an opposing side; and    a third ground plane sandwiched between the dielectric material sides of the front-side and the back-side microstrip circuit portions.    
   
   
       45 . The signal processing module of  claim 44 , wherein: 
 the signal processing module defines an-interface edge with one or more input ports and one or more output ports located at the interface edge; and    the integral double-sided microstrip circuit performs the signal processing operation on signals received by the at the input ports, propagating through the integral double-sided microstrip circuit and delivered to the output ports.    
   
   
       46 . The signal processing module of  claim 45 , further comprising: 
 one or more tap-through connectors electrically connecting the printed circuit side of the front-side microstrip circuit portion to the printed circuit side of the back-side microstrip circuit portion;    the tap-through connectors extending through and electrically insulated from the third ground plane; and    wherein the printed circuit sides of the front-side and back-side circuit portions, as connected by the tap-through connectors, form an integral double-sided microstrip circuit.    
   
   
       47 . The signal processing module of  claim 45 , wherein the integral double-sided microstrip circuit comprises an orthogonal signal processing network implementing a crossover defined by the printed circuit sides of the front-side and back-side circuit portions and the tap-through connectors.  
   
   
       48 . The signal processing module of  claim 47 , wherein the orthogonal signal processing network comprises a Butler matrix circuit signal processing network.  
   
   
       49 . The signal processing module of  claim 47 , wherein the orthogonal signal processing network implements a circuit selected from the group consisting of: 
 a two-by-four beam steering circuit;    a diplexer filter circuit comprising at least three ports;    a four-by-four Butler matrix circuit;    an eight-by-eight Butler matrix circuit; and    a monopulse comparator circuit.    
   
   
       50 . A signal processing module configured to perform a signal processing operation on signals propagating through the module, comprising: 
 a multi-layer double-sided stripline PC circuit board comprising a series of thin, flat parallel layers defining an interface edge with one or more input ports and one or more output ports located at the interface edge;    the PC circuit board comprising: 
 a first layer comprising a first microstrip transmission media circuit portion exposed to air on one side and a second layer on its other side;  
 the second layer comprising a first dielectric substrate on which the first microstrip transmission media is printed to form a first PC board, the second layer exposed to the first layer on one side and a third layer on its other side;  
 the third layer comprising a common ground plane exposed to an adhesive layer on one side and the second or a fourth layer on its other side;  
 the fourth layer comprising a second dielectric substrate on which a second microstrip transmission media is printed to form a second PC board, the fourth layer exposed to a fifth layer on one side and the adhesive layer or the ground plane on its other side; and  
 the fifth layer comprising a second microstrip transmission media circuit portion exposed to air on one side and a fourth layer on its other side.  
   
   
   
       51 . The signal processing module of  claim 50 , further comprising: 
 one or more tap-through connectors electrically connecting the first layer to the fifth layer, extending through the second, third and fourth layers, and electrically insulated from the ground plane;    wherein the first and second microstrip transmission media circuit portions, as connected by the tap-through connectors, form an integral double-sided microstrip circuit with the ground plane sandwiched in the middle; and    wherein the integral double-sided microstrip circuit performs the signal processing operation on signals received by the at the input ports, propagating through the integral double-sided microstrip circuit and delivered to the output ports.    
   
   
       52 . The signal processing module of  claim 51 , wherein the integral double-sided microstrip circuit comprises an orthogonal signal processing network implementing a crossover defined by the first and second microstrip transmission media circuit portions and the tap-through connectors.  
   
   
       53 . The signal processing module of  claim 51 , wherein the orthogonal signal processing network comprises a Butler matrix circuit signal processing network.  
   
   
       54 . The signal processing module of  claim 52 , wherein each network module implements a circuit selected from the group consisting of: 
 a two-by-four beam steering circuit;    a diplexer filter circuit comprising at least three ports;    a four-by-four Butler matrix circuit;    an eight-by-eight Butler matrix circuit; and    a monopulse comparator circuit.    
   
   
       55 . The signal processing module of  claim 50 , further comprising a third microstrip transmission media circuit portion carried on the side of second layer opposing the first layer.