Semiconductor part for component mounting, mounting structure and mounting method

Abstract

A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side. A mounting method and mounting structure having land terminals arrayed on a printed circuit board or substrate with the same arrangement as the area terminals of the semiconductor component, and the land terminals are connected with the area terminals by a conductive bonding agent.

1 . A method of producing portable electronic equipment, the portable electronic equipment including: 
 an integrated circuit having a function for the portable electronic equipment,    an interposer board including the integrated circuit and comprising an outer circumferential side and an inner circumferential side, one or more area terminals arrayed on the outer circumferential side of the interposer board, and one or more area terminals arrayed on the inner circumferential side of the interposer board, and    a printed circuit board comprising an outer circumferential side and an inner circumferential side, one or more land terminals arrayed on the outer circumferential side of the printed circuit board, and one or more terminals arrayed on the inner circumferential side of the printed circuit board,    the method comprising the steps of:    (a) setting the integrated circuit on the substrate of the interposer board;    (b) applying a conductive bonding solution to at least one of the area terminals arrayed on the outer circumferential side, the area terminals arrayed on the inner circumferential side, the land terminals arrayed on the outer circumferential side, and the land terminals arrayed on the inner circumferential side; and    (c) connecting the area terminal arrayed on the outer circumferential side to the land terminal arrayed on the outer circumferential side, and the area terminal arrayed on the inner circumferential side to the land terminal arrayed on the inner circumferential side;    wherein the area terminal on the outer circumferential side is arrayed with a larger pitch than the area terminal on the inner circumferential side; and    wherein the land terminal on the outer circumferential side is arrayed with a larger pitch than the land terminal on the inner circumferential side.