US2005167765A1PendingUtilityA1

Semiconductor device with an L-shaped/reversed L-shaped gate side-wall insulating film and method of manufacturing same

Assignee: TOSHIBA KKPriority: Dec 27, 2000Filed: Mar 28, 2005Published: Aug 4, 2005
Est. expiryDec 27, 2020(expired)· nominal 20-yr term from priority
Inventors:Akira Hokazono
H10W 10/17H10W 10/014H10D 84/0151H10D 84/038H10D 84/013H10D 64/259H10D 64/258H10D 64/015H10D 30/0275H10D 30/0215H10D 30/0212H10D 30/60Y10S257/90
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Claims

Abstract

Provided is a semiconductor device, comprising a gate electrode formed on a semiconductor substrate, source/drain diffusion layers formed on both sides of the gate electrode, a gate electrode side-wall on the side of the source/drain diffusion layer and a gate side-wall insulating film covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode and having an L-shaped/reversed L-shaped cross-sectional shape, and a semiconductor layer extending over the gate side-wall insulating film covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising: 
 a device isolation formed in a trench formed in a surface region of a semiconductor substrate, which defines a semiconductor device region, the device isolation comprising a first isolation formed in the trench from a bottom of the trench to a predetermined depth of the trench and a second isolation formed on the first isolation to cover the first isolation, the first isolation including a seam.    
   
   
       2 - 14 . (canceled)  
   
   
       15 . A semiconductor device according to  claim 1 , wherein the device isolation is a shallow trench isolation formed in the trench, and the seam extends from the surface of the first isolation in a depth direction of the trench toward a bottom of the trench substantially at a central portion in a width direction of the trench.  
   
   
       16 . A semiconductor device according to  claim 15 , wherein a transistor having source and drain regions is formed in the device region, and the source and drain regions extend to the device isolation.  
   
   
       17 . A semiconductor device according to  claim 1 , wherein a distance from an open surface of the trench to the predetermined depth to which the first isolation is formed is smaller than a minimum diameter of the trench.

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