US2005167634A1PendingUtilityA1
Etchant for nickel silicide
Est. expiryDec 27, 2021(expired)· nominal 20-yr term from priority
H10P 50/71H10P 14/3806H10P 14/3411H10P 50/667H10D 30/0321H10D 30/6745H10D 30/6731H10D 30/0314H10D 30/67
48
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Claims
Abstract
An etchant for etching nickel silicide (NiSi x ) is provided. The etchant includes about 3% to about 10% by weight of hydrofluoric acid and about 1% to about 5% by weight of hydrogen peroxide.
Claims
exact text as granted — not AI-modified1 . An etchant for nickel silicide (NiSi x ), comprising:
about 3% to about 10% by weight of hydrofluoric acid; and about 1% to about 5% by weight of hydrogen peroxide.
2 . The etchant according to claim 1 , wherein the hydrofluoric acid of the etchant is about 5% by weight and the hydrogen peroxide of the etchant is about 3% by weight.Join the waitlist — get patent alerts
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