Method of fabricating a stamper with microstructure patterns

Abstract

A method of fabricating a stamper with microstructure patterns includes providing a substrate, forming a first patterned layer on the substrate, forming a second patterned layer on the substrate for defining an edge of the stamper, and performing an electroforming process by taking the second pattern layer as a growth stop wall so as to form the stamper.

1 . A method of fabricating a stamper with microstructure patterns, the method comprising: 
 providing a substrate;    forming a first patterned layer on the substrate, a pattern of the first patterned layer being complementary to the microstructure patterns;    forming a second patterned layer on the substrate for defining an edge of the stamper; and    performing an electroforming process by taking the second patterned layer as a growth stop wall so as to form the stamper.    
     
     
         2 . The method of  claim 1 , wherein the method further comprises forming a seed layer above the substrate.  
     
     
         3 . The method of  claim 2 , wherein the seed layer is formed on a surface of the substrate and covers the first patterned layer so that a pattern presented by the seed layer on the first patterned layer is the same as the pattern of the first patterned layer.  
     
     
         4 . The method of  claim 2 , wherein the seed layer is formed between the substrate and the first patterned layer.  
     
     
         5 . The method of  claim 2 , wherein the seed layer is a metal layer.  
     
     
         6 . The method of  claim 1 , wherein the substrate comprises a conductive material.  
     
     
         7 . The method of  claim 1 , wherein the second patterned layer does not overlap the first patterned layer.  
     
     
         8 . The method of  claim 1 , wherein a thickness of the second patterned layer is greater than a thickness of the stamper.  
     
     
         9 . The method of  claim 1 , wherein the first patterned layer comprises a photosensitive material.  
     
     
         10 . The method of  claim 9 , wherein the first patterned layer is a positive photoresist layer or a negative photoresist layer.  
     
     
         11 . The method of  claim 1 , wherein the second patterned layer comprises a photosensitive material.  
     
     
         12 . The method of  claim 11 , wherein the second patterned layer is a positive photoresist layer or a negative photoresist layer.  
     
     
         13 . The method of  claim 1 , wherein the first patterned layer comprises a conductive material.  
     
     
         14 . The method of  claim 1 , wherein the second patterned layer comprises an isolating material.  
     
     
         15 . The method of  claim 1 , wherein the method further comprises releasing the stamper from the substrate so as to produce the complete stamper without a further cutting process.