Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Abstract

The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

1 - 14 . (canceled)  
     
     
         15 . A method of producing a circuit substrate onto which a semiconductor device is to be mounted, comprising: 
 printing conductive adhesive onto input/output terminal electrodes on a surface of a main body, thereby forming conductive adhesive portions; and    after curing said conductive adhesive portions, coating said surface of said main body with a resin film so as to cover said conductive adhesive portions and said input/output terminal electrodes.    
     
     
         16 . A method of producing a circuit substrate for packaging a semiconductor device, comprising: 
 forming conductive adhesive portions on a resin film;    covering with said resin film a surface of a main body having input/output terminal electrodes thereon, such that said conductive adhesive portions face said input/output terminal electrodes; and    bonding said resin film to said main body.    
     
     
         17 . The method according to  claim 16 , wherein 
 forming conductive adhesive portions on a resin film comprises printing conductive adhesive paste onto said resin film in a pattern.    
     
     
         18 . The method according to  claim 16 , wherein 
 forming conductive adhesive portions on a resin film comprises 
 (i) bonding a masking sheet to said resin film,  
 (ii) boring holes that extend through said masking sheet,  
 (iii) filling said holes with conductive adhesive, and then  
 (iv) removing said masking sheet from said resin film.  
   
     
     
         19 . The method according to  claim 18 , wherein said masking sheet comprises a resin sheet and a release sheet releasably attached to said resin sheet, 
 such that bonding said masking sheet to said resin film comprises bonding said resin sheet to said resin film.    
     
     
         20 . The method according to  claim 18 , wherein 
 boring holes that extend through said masking sheet comprises using a laser to form perforations through said masking sheet.    
     
     
         21 . The method according to  claim 18 , wherein 
 boring holes that extend through said masking sheet comprises using ultraviolet radiation to form perforations through said masking sheet.    
     
     
         22 . A method of producing a package structure, comprising: 
 applying conductive adhesive onto input/output terminal electrodes on a surface of a substrate, thereby forming conductive adhesive portions; and    covering said surface of said substrate body with a resin material such that said conductive adhesive portions are covered by said resin material;    pressing bump electrodes of a semiconductor device into said resin material, while said resin material is in a molten state due to being heated, such that said bump electrodes penetrate through and become fixed to said conductive adhesive portions, whereby said bump electrodes become electrically connected to corresponding ones of said input/output terminal electrodes; and then    curing said resin material so as to join said semiconductor device to said substrate.    
     
     
         23 . The method according to  claim 22 , wherein said resin material comprises a resin film.  
     
     
         24 . The method according to  claim 22 , wherein said resin material comprises a liquid sealing resin.  
     
     
         25 . The method according to  claim 22 , wherein said resin material comprises a liquid sealing resin on a resin film.  
     
     
         26 . The method according to  claim 22 , wherein said semiconductor device includes an elastomer layer bonded to a part of a surface corresponding to a semiconductor functional part of said semiconductor device, 
 such that pressing said bump electrodes into said resin material results in said elastomer layer being interposed between said resin material and said semiconductor device.    
     
     
         27 . The method according to  claim 26 , wherein said resin material comprises a resin film.  
     
     
         28 . A method of producing a package structure, comprising: 
 positioning a resin film, having conductive adhesive portions on one surface thereof and an elastomer layer on another surface thereof that is to correspond to a semiconductor device, on a substrate having input/output terminal electrodes on a surface thereof, such that said conductive adhesive portions correspond to said input/output terminal electrodes, respectively;    pressing bump electrodes of a semiconductor device into said resin film, while said resin film is in a molten state, such that said bump electrodes reach said conductive adhesive portions and become connected to corresponding ones of said input/output terminal electrodes; and    curing said resin film so as to join said semiconductor device to said substrate.