Phase change thermal interface composition having induced bonding property

Abstract

An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petrolatum having electrically-conductive particles suspended therein, which preferably include graphite diamond, or elemental metals such as silver. In the preferred embodiment, the composition further includes a resin polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for packaging the compositions of the present invention, as well as applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.

1 - 18 . (canceled)  
     
     
         19 . A thermally-conductive composition for facilitating the transfer of heat from an electronic component to a heat sink comprising: 
 (a) 60% to 90% by weight of paraffin;    (b) 0% to 5% by weight of resin; and    (c) 10% to 40% by weight of an electrically-conductive filler.    
     
     
         20 . The composition of  claim 19  wherein said electrically-conductive filler is selected from the group consisting of graphite, diamond, silver, and copper.  
     
     
         21 . The composition of  claim 19  wherein said composition is formulated to take a form selected from the group consisting of a film and a bar.  
     
     
         22 . The composition of  claim 19  wherein said resin is present in an amount of 3.3% or less by weight of said composition.  
     
     
         23 . The composition of  claim 19  wherein said composition further comprises petrolatum, said petrolatum being present in an amount no greater than 22.5% by weight of said composition.  
     
     
         24 . The composition of  claim 19  wherein said paraffin comprises 51° C. paraffin wax.  
     
     
         25 . The composition of  claim 19  wherein said paraffin comprises 60° C. paraffin wax.  
     
     
         26 . The composition of  claim 19  wherein said resin comprises an ethylene vinyl acetate copolymer.  
     
     
         27 - 38 . (canceled)  
     
     
         39 . The composition of  claim 19  wherein said paraffin component is present in an amount of approximately 67.2% by weight; said resin is present in amounts of approximately 3.3% by weight; and said electrically-conductive fillers present in an amount of approximately 29.5% by weight.  
     
     
         40 . A thermally-conductive composition for facilitating the transfer of heat from an electronic component to a heat sink, said composition consisting essentially of: 
 (a) a wax component;    (b) a resin component;    (c) an electrically-conductive filler; and    (d) optionally, a thinning agent; and    (e) optionally, a thickening agent; and    (f) optionally, a petrolatum component.    
     
     
         41 . The composition of  claim 40  wherein said thinning agent comprises a polyalphaolephin.  
     
     
         42 . The composition of  claim 40  wherein said thinning agent is present in an amount no greater than about 2% by weight of said composition.  
     
     
         43 . The composition of  claim 40  wherein said thickening composition comprises fumed silicia.  
     
     
         44 . The composition of  claim 40  wherein said thickening agent is present in an amount no greater than about 5.0% by weight of said composition.  
     
     
         45 . The composition of  claim 40  wherein said petrolatum component is present in an amount no greater than about 22.5% by weight of said composition.  
     
     
         46 . A thermally-conductive composition for facilitating the transfer of heat from an electronic component to a heat sink, said composition comprising: 
 (a) 67-67.5% by weight of paraffin;    (b) 29-30% by weight of graphite; and    (c) 3.0-3.5% by weight of resin.