Electroplating apparatus with segmented anode array

Abstract

An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

1 - 16 . (canceled)  
     
     
         17 . A method for electrochemically processing a microelectronic workpiece, comprising: 
 contacting a surface of a workpiece with a liquid processing solution as the processing solution flows through a reactor vessel;    controlling electrical potentials applied independently to a plurality of separate electrodes such that individual electrodes establish field components of an electrical field in the processing solution; and    differing the electrical field in the processing solution over time to electrochemically process the surface of the workpiece.    
     
     
         18 . The method of  claim 17  wherein the plurality of electrodes comprise a first annular conductive element and a second annular conductive element concentric with the first annular conductive element, and wherein controlling the electrical potentials comprises applying a first electrical potential to the first annular conductive element and a second electrical potential to the second annular conductive element that is different than the first electrical potential.  
     
     
         19 . The method of  claim 18  wherein differing the electrical field comprises differing at least one of the first and second electrical potentials over the time of electrochemically processing the surface of the workpiece.  
     
     
         20 . The method of  claim 17  wherein controlling the electrical potentials comprises applying different electrical potentials to different electrodes and differing the electrical field comprises applying the different electrical potentials to the different electrodes at differing times over the time of electrochemically processing surface of the workpiece.  
     
     
         21 . The method of  claim 20  wherein the plurality of electrodes comprise a circular first conductive element and a circular second conductive element concentrically surrounding the first conductive element, and wherein controlling the electrical potentials comprises generating concentric field components in the electrical field.  
     
     
         22 . A method for electrochemically processing a microelectronic workpiece, comprising: 
 contacting a surface of a workpiece with a liquid processing solution as the processing solution flows through a reactor vessel;    applying electrical potentials independently to a plurality of separate electrodes such that individual electrodes establish field components of an electrical field in the processing solution; and    compensating for radial affects on the workpiece by differing at least one of the field components over a time of electrochemically processing the surface of the workpiece.    
     
     
         23 . The method of  claim 22  wherein applying electrical potentials independently to the plurality of electrodes comprises applying different electrical potentials to different electrodes.  
     
     
         24 . The method of  claim 22  wherein differing at least one of the field components over the time of electrochemically processing the surface of the workpiece comprises differing at least one of the electrical potentials applied to one of the electrodes.  
     
     
         25 . A method for electrochemically processing a microelectronic workpiece, comprising: 
 passing a liquid processing solution through a reactor vessel;    contacting a surface of the workpiece with the liquid processing solution;    establishing an electrical field in the liquid processing solution by independently operating a first electrode and a second electrode separate from the first electrode, wherein the first and second electrodes are in the reactor vessel; and    applying different electrical potentials to the first and second electrodes for different periods of time to electrochemically process the surface of the workpiece.    
     
     
         26 . The method of  claim 25  wherein applying different electrical potentials to the first and second electrodes for different periods of time comprises changing an electrical potential to at least one of the first and second electrodes over the time of electrochemically processing the surface of the workpiece.  
     
     
         27 . A method for electrochemically processing a microelectronic workpiece, comprising: 
 contacting a surface of the workpiece with a liquid processing solution while passing the liquid processing solution through a reactor vessel;    independently operating a first electrode and a second electrode separate from the first electrode, wherein the first and second electrodes are in the reactor vessel and spaced apart from the workpiece; and    changing electrical potentials applied to the first and second electrodes to electrochemically process the surface of the workpiece.    
     
     
         28 . A method for electrochemically processing a microelectronic workpiece, comprising: 
 contacting a surface of the workpiece with a liquid processing solution while passing the liquid processing solution through a reactor vessel;    applying a first electrical potential to a first electrode located in the reactor vessel and spaced apart from the workpiece;    applying a second electrical potential to a second electrode located in the reactor vessel and spaced apart from the workpiece, the second electrode being separate from the first electrode, and the second electrical potential being different than the first electrical potential; and    changing the first electrical potential and/or the second electrical potential to electrochemically process the surface of the workpiece.    
     
     
         29 . An apparatus for electrochemically processing a microelectronic workpiece, comprising: 
 a reactor vessel having a container for holding a liquid processing solution;    an electrode array in the reactor vessel, the electrode array including a first electrode and a second electrode separate from the first electrode; and    a control arrangement operatively coupled to the electrode array, wherein the control arrangement is configured to (a) independently apply different electrical potentials to the first and second electrodes such that the first and second electrodes establish individual field components of an electrical field in the processing solution, and (b) differ the electrical field in the processing solution over time to electrochemically process the workpiece.    
     
     
         30 . The apparatus of  claim 29  wherein the first electrode comprises a first annular conductive member and the second electrode comprises a second annular conductive member concentric with the first annular conductive member to establish concentric field components in the electrical field.  
     
     
         31 . The apparatus of  claim 29  wherein the first electrode comprises a first annular conductive member, the second electrode comprises a second annular conductive member concentric with the first annular conductive member, and the electrode array further comprises an annular wall between the first and second annular conductive members.  
     
     
         32 . The apparatus of  claim 29  wherein the control arrangement is configured to differ the electrical field by differing at least one of the electrical potentials applied to one of the first and second electrodes over the time to electrochemically process the surface of the workpiece.  
     
     
         33 . An apparatus for electrochemically processing a microelectronic workpiece, comprising: 
 a reactor vessel configured to contain a processing solution;    an electrode array having a plurality of separate electrodes in the reactor vessel;    electrical wiring connected to the separate electrodes and configured to independently provide electrical potentials to the separate electrodes; and    a controller operatively connected to the electrical wiring, the controller being configured to apply different electrical potentials to the separate electrodes at different periods of time via the electrical wiring to electrochemically process the workpiece.    
     
     
         34 . The apparatus of  claim 33  wherein the electrode array comprises a first annular conductive member and a second annular conductive member concentric with the first annular conductive member.  
     
     
         35 . The apparatus of  claim 34  further comprising an annular wall between the first annular conductive member and the second annular conductive member.  
     
     
         36 . The apparatus of  claim 34  wherein the controller is configured to change the electrical potentials applied to the first and second annular conductive members at different periods of time to plate onto the workpiece.  
     
     
         37 . An apparatus for electrochemically processing a microelectronic workpiece, comprising: 
 a reactor vessel having a container for holding a liquid processing solution;    an electrode array in the reactor vessel, the electrode array including a first electrode and a second electrode separate from the first electrode; and    a control arrangement operatively coupled to the electrode array, wherein the control arrangement is configured to operate the first and second electrodes independently at differing electrical potentials to electrochemically process the workpiece.    
     
     
         38 . The apparatus of  claim 37  wherein the control arrangement is configured to apply different electrical potentials to the first and second electrodes.  
     
     
         39 . The apparatus of  claim 37  wherein the first electrode comprises a first annular conductive member and the second electrode comprises a second annular conductive member concentric with the first annular conductive member.  
     
     
         40 . The apparatus of  claim 37  wherein the first electrode comprises a first annular conductive member, the second electrode comprises a second annular conductive member concentric with the first annular conductive member, and the electrode array further comprises an annular wall between the first and second annular conductive members.