Electroplating apparatus with segmented anode array

Abstract

An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

1 - 16 . (canceled)  
   
   
       17 . An apparatus for electrochemical processing of microelectronic workpieces, comprising: 
 a reactor vessel configured to contain a flow of processing fluid and having an inner axis extending at least generally vertically;    an electrode array having a plurality of separate electrodes in the reactor vessel that are configured to operate independently from each other; and    a rotor assembly above the electrode array, the rotor assembly having a workpiece holder configured to receive and hold a workpiece, and the rotor assembly being configured to rotate the workpiece holder and tilt the workpiece holder at an angle inclined relative to the inner axis.    
   
   
       18 . The apparatus of  claim 17  wherein the electrode array comprises a first electrode and a second electrode concentric with the first electrode.  
   
   
       19 . The apparatus of  claim 17  wherein the electrode array comprises a first annular conductive member and a second annular conductive member.  
   
   
       20 . The apparatus of  claim 19 , further comprising an annular wall between the first annular conductive member and the second annular conductive member.  
   
   
       21 . The apparatus of  claim 17  wherein the electrode array comprises a platform, a first electrode over a first area of the platform, and a second electrode over a second area of the platform and concentric with the first electrode.  
   
   
       22 . The apparatus  17 , further comprising a controller operatively coupled to the separate electrodes, wherein the electrode assembly comprises a first electrode and a second electrode, and wherein the controller is programmed to apply a first current to the first electrode and a second current to this second electrode that is different than the first current.  
   
   
       23 . The apparatus of  claim 17  wherein the rotor assembly is configured to position the workpiece holder at an orientation that is in a range from perpendicular to the inner axis to an angle of approximately 2° from perpendicular to the inner axis.  
   
   
       24 . The apparatus of  claim 17  wherein the rotor assembly is configured to hold the workpiece holder at an angle of approximately 2° from being perpendicular to the inner axis.  
   
   
       25 . An apparatus for electrochemical processing of microelectronic workpieces, comprising: 
 a reactor vessel having a weir defining a weir plane in the reactor vessel;    an electrode array having a first electrode and a second electrode separate from the first electrode, wherein the first and second electrodes are in the reactor vessel below the weir; and    a rotor assembly having a workpiece holder configured to receive and hold a workpiece, wherein the rotor assembly is configured to rotate the workpiece holder in a workpiece plane inclined at an angle with respect to the weir plane.    
   
   
       26 . The apparatus of  claim 25  wherein the rotor assembly is configured such that the workpiece plane is inclined at an angle of approximately 2° with respect to the weir plane.  
   
   
       27 . The apparatus of  claim 25  wherein the first electrode comprises a first annular conductive member and the second electrode comprises a second annular conductive member.  
   
   
       28 . The apparatus of  claim 27  wherein the first annular conductive member comprises a first conductive ring and the second annular conductive member comprises a second conductive ring.  
   
   
       29 . The apparatus of  claim 25 , further comprising an annular wall between the first electrode and the second electrode.  
   
   
       30 . The apparatus of  claim 25 , further comprising a controller operatively coupled to the electrodes, wherein the controller is programmed to apply a first current to the first electrode and a second current different than the first current to the second electrode.  
   
   
       31 . An apparatus for electrochemical processing of microelectronic workpieces, comprising: 
 means for directing a processing solution to overflow a weir;    electrode means in the means for containing the flow of processing solution, the electrode means having a plurality of separate electrodes; and    means for holding a workpiece at an inclined angle with respect to the overflow weir.    
   
   
       32 . The apparatus of  claim 31  wherein the means for containing the flow of processing fluid comprises a reactor vessel having the weir and the electrode means comprises a first electrode and a second electrode concentric with the first electrode.  
   
   
       33 . The apparatus of  claim 31  wherein the holding means comprises a workpiece holder having a first portion located a first distance from the weir and a second portion located a second distance from the weir that is less than the first distance.