US2005161126A1PendingUtilityA1
High-strength high-conductivity copper alloy
Est. expiryJan 23, 2024(expired)· nominal 20-yr term from priority
C22C 9/00C22C 9/02
46
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Claims
Abstract
Disclosed is a copper alloy containing Fe of 0.01 to 0.5% and P of 0.01 to 0.3% in mass with the balance consisting of copper and unavoidable impurities, wherein the mass content ratio of Fe to P, namely Fe/P, is in the range from 0.5 to 6.0 and the volume fraction and the number of dispersoids of 1 to 20 nm in average particle diameter in the microstructure of the copper alloy are 1.0% or more and 300 pieces/μm 2 or more, respectively. The Cu—Fe—P alloy can secure a high strength and a high conductivity simultaneously.
Claims
exact text as granted — not AI-modified1 . A high-strength high-conductivity copper alloy containing Fe of 0.01 to 0.5 mass % and P of-0.01 to 0.3 mass % with the balance consisting of copper and unavoidable impurities,
wherein
the mass content ratio of Fe to P, namely Fe/P, is in the range from 0.5 to 6.0 and
the volume fraction and the number of dispersoids of 1 to 20 nm in average particle diameter in the microstructure of the copper alloy are 1.0% or more and 300 pieces/μm 2 or more, respectively.
2 . The copper alloy according to claim 1 , further containing Zn of 0.005 to 0.5 mass %.
3 . The copper alloy according to claim 1 , further containing Sn of 0.001 to 0.5 mass %.Join the waitlist — get patent alerts
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