Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit

Abstract

According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.

1 . A metal-containing resin particle, comprising: 
 a resin containing 50 wt % or more of a thermosetting resin, and having a rate of moisture absorption from 500 to 14500 ppm; and    a fine metal particle contained in said resin.    
     
     
         2 . The metal-containing resin particle according to  claim 1 , 
 wherein said resin has the rate of moisture absorption from 4000 to 8000 ppm.    
     
     
         3 . The metal-containing resin particle according to  claim 1 , 
 wherein the thermosetting resin comprises a B-stage thermosetting resin.    
     
     
         4 . The metal-containing resin particle according to  claim 1 , 
 wherein said fine metal particle is at least one kind of the fine metal particles selected from the group consisting of platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag).    
     
     
         5 . A resin particle comprising: 
 a resin containing 50 wt % or more of a thermosetting resin, and having the rate of moisture absorption from 500 to 14500 ppm.    
     
     
         6 . The resin particle according to  claim 5 , 
 wherein said resin has the rate of moisture absorption from 4000 to 8000 ppm.    
     
     
         7 . The resin particle according to  claim 5 , 
 wherein said thermosetting resin comprises a B-stage thermosetting resin.    
     
     
         8 . An electronic circuit substrate, comprising: 
 a substrate;    a metal-containing resin layer formed on said substrate, and formed by using the metal-containing resin particle according to  claim 1;  and    a plating layer formed on said metal-containing resin layer by using said fine metal particle as a kernel.    
     
     
         9 . The electronic circuit substrate according to  claim 8 , further comprising: 
 a resin layer formed on said plating layer and formed by using the resin particle according to  claim 5 .    
     
     
         10 . An electronic circuit substrate, comprising: 
 a substrate;    a plating layer formed on said substrate; and    a resin layer formed on said plating layer and formed by using the resin particle according to  claim 5 .    
     
     
         11 . A method of producing an electronic circuit, comprising: 
 forming a metal-containing resin layer in an environment at 70% or less of relative humidity,    wherein said forming of the metal-containing resin layer comprises,    forming a visible image on the surface of a photoconductor on which an electrostatic latent image is formed by electrostatically attaching said metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having the rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in said resin; and    transferring the visible image composed of said metal-containing resin particles and formed on the surface of said photoconductor onto a substrate.    
     
     
         12 . The method of producing an electronic circuit according to  claim 11 , 
 wherein said resin has the rate of moisture absorption from 4000 to 8000 ppm.    
     
     
         13 . The method of producing the electronic circuit according to  claim 11 , 
 wherein said thermosetting resin comprises a B-stage thermosetting resin.    
     
     
         14 . The method of producing the electronic circuit according to  claim 11 , 
 wherein said fine metal particle is at least one kind of the fine metal particles selected from the group consisting of platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag).    
     
     
         15 . The method of producing the electronic circuit according to  claim 11 , further comprising: 
 forming a plating layer on the metal-containing resin layer by using the fine metal particle as a kernel; and    forming a resin layer to be performed in an environment at 70% or less of relative humidity,    wherein said forming of the resin layer comprises:    forming the visible image on the surface of the photoconductor on which the electrostatic latent image is formed by electrostatically attaching resin particles composed of the resin containing 50 wt % or more of a thermosetting resin and having a rate of moisture absorption from 500 to 14500 ppm; and    transferring the visible image composed of the resin particles and formed on the surface of the photoconductor onto the plating layer.    
     
     
         16 . The method of producing the electronic circuit according to  claim 15 , 
 wherein the resin in the resin particle has a rate of moisture absorption from 4000 to 8000 ppm.    
     
     
         17 . The method of producing the electronic circuit according to  claim 15 , 
 wherein the thermosetting resin in the resin particle comprises a B-stage thermosetting resin.    
     
     
         18 . A method of producing the electronic circuit, comprising: 
 forming a resin layer to be performed in an environment at 70% or less of relative humidity,    wherein said forming of resin layer comprises,    forming a visible image on a surface of a photoconductor on which an electrostatic latent image is formed by electrostatically attaching resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a rate of moisture absorption from 500 to 14500 ppm; and    transferring the visible image composed of the resin particles and formed on the surface of the photoconductor onto a substrate.    
     
     
         19 . The method of producing the electronic circuit according to  claim 18 , 
 wherein the resin has a rate of moisture absorption from 4000 to 8000 ppm.    
     
     
         20 . The method of producing the electronic circuit according to  claim 18 , 
 wherein the thermosetting resin comprises a B-stage thermosetting resin.