Method and apparatus for making devices

Abstract

A method and an apparatus for manufacturing a device are provided. The method and the apparatus can form micro wiring without undesired wetting and spreading using an inexpensive functional-liquid supplying method. A method for forming a device, such as a radiofrequency identification tag, includes: making patterns at a plurality of sections having different degrees of affinity to the functional liquid on a substrate to form the device; and supplying the functional liquid to the selected section having high affinity to the functional liquid. Forming the plurality of sections having different degrees of affinity to the functional liquid includes;, for example: supplying an organosiloxane film on the substrate, and exposing the organosiloxane film through an optical mask.

1 . A method for forming a device by supplying a functional liquid on a substrate to form the device, comprising: 
 making patterns of banks to prevent overflow of the functional liquid on the substrate to form the device; and    supplying the functional liquid on selected areas inside the banks.    
     
     
         2 . An apparatus for making a device by supplying a functional liquid onto a substrate to form the device, comprising: 
 a patterning unit to make patterns of banks to prevent the overflow of the functional liquid on the substrate to form the device; and    a functional liquid supplying unit to supply the functional liquid on selected areas inside the banks.    
     
     
         3 . A method for making a device by supplying a metal-containing liquid onto a substrate to form the device, comprising: 
 forming a hole in the substrate to form the device; and    supplying the metal-containing liquid into the hole.    
     
     
         4 . The method for making the device according to  claim 3 , further including disposing terminals of electrical circuit device patterns in the hole at different positions in the substrate thickness direction.  
     
     
         5 . The method for making the device according to  claim 4 , the substrate having a multilayer structure including: a plurality of electrical circuit pattern layers and at least one insulating layer between the electrical circuit layers, and the metal-containing liquid in the hole electrically connecting electrical circuit patterns of different layers to each other.  
     
     
         6 . The method for making the device according to  claim 3 , further including replacing the hole with a plurality of slits extending in parallel to each other in a particular direction in the substrate surface.  
     
     
         7 . An apparatus for making a device by supplying a metal-containing liquid to a substrate to form the device, comprising: 
 a processing unit to form a hole in the substrate to form the device; and    a liquid supplying unit to supply the metal-containing liquid into the hole.