Method for manufacturing organic light-emitting panel

Abstract

An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.

1 . A manufacturing method of an organic light-emitting panel, comprising the steps of: 
 fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and    adhering a front board to the first surface of the rear board and the heat spreader.    
   
   
       2 . The method according to  claim 1 , wherein the heat spreader which covers over the first surface of the rear board is formed with plural holes.  
   
   
       3 . The method according to  claim 1 , wherein the front board includes a transparent substrate, a transparent anode, an organic electroluminescence layer and a cathode.  
   
   
       4 . The method according to  claim 1 , wherein the front board is adhered to the heat spreader and the rear board by a conductive adhesive and an adhesive agent.  
   
   
       5 . The method according to  claim 4 , wherein the conductive adhesive is an epoxy resin.  
   
   
       6 . The method according to  claim 4 , wherein the adhesive agent is a non-conductive adhesive.  
   
   
       7 . The method according to  claim 1 , wherein the rear board is a printed circuit board.  
   
   
       8 . The method according to  claim 1 , wherein the heat spreader is formed by way of press molding.  
   
   
       9 . The method according to  claim 1 , wherein the heat spreader is isolated.  
   
   
       10 . The method according to  claim 1 , wherein the heat spreader is made of a metal, and a metal oxide is formed on a surface of the heat spreader.