Micromirror systems with open support structures

Abstract

Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.

1 . A micromirror device comprising: 
 a substrate with electrical components including address circuitry, and    an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions,    wherein at least one portion of each micromechanical light modulating element is held above said substrate by an open support.    
   
   
       2 . A micromirror device comprising: 
 a substrate with electrical components including address circuitry, and    an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions,    wherein at least one portion of each micromechanical light modulating element is held above said substrate by a support located at a border region.    
   
   
       3 . The device of  claim 1  or  2 , wherein each mirror portion is held above said substrate by a pair of discrete supports.  
   
   
       4 . The device of  claim 3 , wherein said supports comprises a plurality of vertical sections.  
   
   
       5 . The device of  claim 4 , wherein said plurality of vertical sections meet at a common base affixed to one of said hinge portions.  
   
   
       6 . The device of  claim 1  or  2 , wherein said hinge portions are held above said substrate by at least one support.  
   
   
       7 . The device of  claim 6 , wherein said hinge portions are attached to a connector segment spanning adjacent supports.  
   
   
       8 . The device of  claim 1  or  2 , wherein at least one of said electrode portions is held above said substrate by at least one support.  
   
   
       9 . The device of  claim 8 , wherein only one support is provided for each electrode portion, thereby supporting each said portion in a cantilever fashion.  
   
   
       10 . A method of manufacturing support structures in a micromirror device comprising, a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror portion and a plurality of electrode portions, said method comprising: 
 producing a precursor structure comprising two columns and an upper surface,    removing portions of said columns and said upper surface, leaving only a spanning segment of said precursor upper surface located between said precursor columns, and support portions of said columns attached to said spanning segment.    
   
   
       11 . The method of  claim 10 , wherein said spanning segment comprises an electrode portion.  
   
   
       12 . The method of  claim 10 , wherein said spanning segment comprises a mirror portion.  
   
   
       13 . The method of  claim 10 , wherein said spanning segment is attached to at least one hinge portion.  
   
   
       14 . A method of manufacturing electrodes in a micromirror device, comprising, a substrate with electrical components including address circuitry, and an array of micromechanical light modulator elements, each micromechanical light modulator element comprising a mirror portion above said substrate, a plurality of hinge portions below said mirror and a plurality of electrode portions, said method comprising: 
 providing a sacrificial layer of mater and on a first surface of said substrate,    depositing electrode material over said first surface and a second surface of said sacrificial layer, and    removing said sacrificial layer, leaving at least one electrode with an upper portion supported by a support portion above an electrode lower portion on said substrate.    
   
   
       15 . The method of  claim 14 , wherein said support portion is substantially vertical.  
   
   
       16 . The method of  claim 14 , wherein said electrode at least one electrode comprises two levels.  
   
   
       17 . The method of  claim 14 , wherein said upper portion is angled with respect to said substrate first surface.