Method of packaging an optical sensor

Abstract

An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.

1 - 8 . (canceled)  
     
     
         9 . An image sensor device, comprising: 
 a first leadframe having a central die receiving area surrounded by a plurality of lead fingers;    a sensor integrated circuit (IC) disposed within the die receiving area of the first leadframe, the IC having a first surface with an active area and a peripheral bonding pad area, the peripheral bonding pad area including a plurality of bonding pads;    a plurality of wires wirebonded to respective ones of the IC bonding pads and corresponding ones of the leadframe lead fingers of the first leadframe, thereby electrically connecting the IC and the first leadframe;    a second leadframe having a central lens receiving area;    a transparent lens disposed within the central lens receiving area of the second leadframe, wherein the second leadframe is located over the first leadframe such that the lens is disposed over the IC active area;    a third leadframe located between the first and second leadframes for controlling the spacing between the IC active area and the lens;    a transparent adhesive disposed on the IC active area that secures the lens to the IC; and    a mold compound injected between the first and second leadframes, and over the wirebonds,    
     
     
         10 . The image sensor device of  claim 9 , wherein the transparent adhesive comprises a clear epoxy.  
     
     
         11 . The image sensor device of  claim 9 , wherein the first, second and third leadframes are formed of copper.  
     
     
         12 . The image sensor device of  claim 9 , wherein the lens is made of glass.  
     
     
         13 . The image sensor device of  claim 9 , wherein the first leadframe is a QFN type.  
     
     
         14 . An image sensor device, comprising: 
 a first leadframe having a central die receiving area surrounded by a plurality of lead fingers;    a sensor integrated circuit (IC) disposed within the die receiving area of the first leadframe, the IC having a first surface with an active area and a peripheral bonding pad area, the peripheral bonding pad area including a plurality of bonding pads;    a plurality of wires wirebonded to respective ones of the IC bonding pads and corresponding ones of the leadframe lead fingers of the first leadframe, thereby electrically connecting the IC and the first leadframe;    a second leadframe having a central lens receiving area;    a transparent lens disposed within the central lens receiving area of the second leadframe, wherein the second leadframe is located over the first leadframe such that the lens is disposed over the IC active area; and    a third leadframe located between the first and second leadframes for controlling the spacing between the IC active area and the lens.    
     
     
         15 . The image sensor device of  claim 14 , further comprising a transparent adhesive disposed on the IC active area to secure the lens to the IC.  
     
     
         16 . The image sensor device of  claim 15 , wherein the transparent adhesive comprises a clear epoxy.  
     
     
         17 . The image sensor device of  claim 14 , further comprising a mold compound injected between the first and second leadframes, and over the bond wires.  
     
     
         18 . The image sensor device of  claim 14 , wherein the first, second and third leadframes are formed of copper.  
     
     
         19 . The image sensor device of  claim 14 , wherein the lens is made of glass.  
     
     
         20 . The image sensor device of  claim 14 , wherein the first leadframe is a QFN type leadframe.