Polishing pad, polishing apparatus, and polishing method

Abstract

A polishing pad which ensures that a work can be easily removed from the polishing pad surface after polishing, the amount of a polishing liquid used for polishing can be reduced, and the production cost of the polishing pad can be lowered. A first polishing pad ( 1 ) for polishing a work is provided with a plurality of slots ( 11 ) piercing the first polishing pad ( 1 ) in a sa direction, the length in the longitudinal direction of the slots ( 11 ) being preferably not less than 20 mm, the pitch in the width direction of the slots ( 11 ) being preferably less than 100 mm, and small holes (not shown) may be provided in addition to the slots ( 11 ).

1 . A polishing pad for polishing a work, which is provided with a plurality of slots piercing through said polishing pad in the thickness direction.  
     
     
         2 . A polishing pad as set forth in  claim 1 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         3 . A polishing pad as set forth in  claim 1 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and is less than 100 mm.  
     
     
         4 . A polishing pad for polishing a work, which is provided with a plurality of holes piercing through said polishing pad in the thickness direction, part of said plurality of holes being composed of slots.  
     
     
         5 . A polishing pad as set forth in  claim 4 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         6 . A polishing pad as set forth in  claim 4 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and less than 100 mm.  
     
     
         7 . A polishing apparatus for polishing a surface to be polished of a material to be polished, by bringing a polishing pad into contact with said surface and into a frictional motion relative to said surface, wherein said polishing pad is provided with a plurality of slots piercing through said polishing pad in the thickness direction.  
     
     
         8 . A polishing apparatus as set forth in  claim 7 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         9 . A polishing apparatus as set forth in  claim 7 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and is less than 100 mm.  
     
     
         10 . A polishing apparatus for polishing a surface to be polished of a material to be polished, by bringing a polishing pad into contact with said surface, and into a frictional motion relative to said surface, wherein said polishing pad is provided with a plurality of holes piercing through said polishing pad in the thickness direction, part of said plurality of holes being composed of slots.  
     
     
         11 . A polishing apparatus as set forth in  claim 10 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         12 . A polishing apparatus as set forth in  claim 10 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and is less than 100 mm.  
     
     
         13 . A polishing method for polishing a surface to be polished of a material to be polished, by bringing a polishing pad into contact with said surface, and bringing said surface and said polishing pad into a frictional motion relative to each other, wherein 
 said polishing pad is provided with a plurality of slots piercing through said polishing pad in the thickness direction.    
     
     
         14 . A polishing method as set forth in  claim 13 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         15 . A polishing method as set forth in  claim 13 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and is less than 100 mm.  
     
     
         16 . A polishing method for polishing a surface to be polished of a material to be polished, by bringing a polishing pad into contact with said surface, and bringing said surface and said polishing pad into a frictional motion relative to each other, wherein 
 said polishing pad is provided with a plurality of holes piercing through said polishing pad in the thickness direction, part of said plurality of holes being composed of slots.    
     
     
         17 . A polishing method as set forth in  claim 16 , wherein said slots are so formed as to be included in said polishing pad, and the length in the longitudinal direction of said slots is not less than 20 mm.  
     
     
         18 . A polishing method as set forth in  claim 16 , wherein the pitch in the transverse direction of said slots is not less than twice the length in the transverse direction of said slots and is less than 100 mm.