Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Abstract

A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2 a to the other opening 2 b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

1 . A porous adhesive sheet having a plurality of through holes running in about parallel with each other in the thickness direction of an organic film, wherein each through hole has an about congruent section in the diameter direction from one opening thereof to the other opening thereof, and is surrounded throughout its entire length in the thickness direction of the adhesive sheet by an organic material layer having a softening temperature higher by 10° C. or more than the softening temperature of the organic film, wherein part of the through holes are not filled and part of the through holes are filled with a conductive material, and wherein any conductive material in a through hole is insulated from any conductive material in another through hole.  
     
     
         2 . The porous adhesive sheet of  claim 1 , wherein the through hole maintains its opening even after adhesion.  
     
     
         3 . (canceled)  
     
     
         4 . The porous adhesive sheet of  claim 1 , which comprises, on at least one side of the organic film, an adhesive material layer having the entirety or a part of the through holes present in the organic film and plural communication holes communicating in said thickness direction, wherein the adhesive material layer is composed of a thermoplastic resin or thermosetting polymer having a softening temperature lower than that of the organic film by 10° C.-30° C., and has such thickness as not to close up the through holes in the organic film in an adhesion state.  
     
     
         5 . The porous adhesive sheet of  claim 1 , which comprises, on at least one side of the organic film, an adhesive material layer having the entirety or a part of the through holes present in the organic film and plural communication holes communicating in said thickness direction, wherein the adhesive material layer is composed of a thermosetting oligomer having a melt start temperature lower than the softening temperature of the organic film by not less than 10° C., and has such thickness as not to close up the through holes in the organic film in an adhesion state.  
     
     
         6 - 11 . (canceled)  
     
     
         12 . A semiconductor wafer with a porous adhesive sheet, which comprises a semiconductor wafer having at least one electrode on at least one surface thereof, the porous adhesive sheet of  claim 1 , which is adhered to said surface of the semiconductor wafer, and a conductive part formed by filling each through hole located on the electrode of the semiconductor wafer of the porous adhesive sheet with a conductive material.  
     
     
         13  (canceled)  
     
     
         14 . A semiconductor wafer with a porous adhesive sheet, which comprises a semiconductor wafer having at least one electrode on at least one surface thereof, the porous adhesive sheet of  claim 2 , which is adhered to said surface of the semiconductor wafer, and a conductive part formed by filling each through hole located on the electrode of the semiconductor wafer of the porous adhesive sheet with a conductive material.  
     
     
         15 . A semiconductor wafer with a porous adhesive sheet, which comprises a semiconductor wafer having at least one electrode on at least one surface thereof, the porous adhesive sheet of  claim 4 , which is adhered to said surface of the semiconductor wafer, and a conductive part formed by filling each through hole located on the electrode of the semiconductor wafer of the porous adhesive sheet with a conductive material.  
     
     
         16 . A semiconductor wafer with a porous adhesive sheet, which comprises a semiconductor wafer having at least one electrode on at least one surface thereof, the porous adhesive sheet of  claim 5 , which is adhered to said surface of the semiconductor wafer, and a conductive part formed by filling each through hole located on the electrode of the semiconductor wafer of the porous adhesive sheet with a conductive material.