Cathode for an organic electronics component

Abstract

A metal cathode layer manufactured from a low-melting alloy for an electronic component is described.

1 . An organic electronic component comprising a cathode manufactured from a molten metal alloy.  
     
     
         2 . The organic electronic component according to  claim 1  wherein the alloy is molten at temperatures ranging from 30 to 200° C.  
     
     
         3 . The organic electronic component according to  claim 1 , wherein the metal alloy is insensitive to oxidation.  
     
     
         4 . The organic electronic component according to  claim 3 , wherein the metal alloy is insensitive to oxidation when molten.  
     
     
         5 . The organic electronic component according to  claim 1 , wherein the metal alloy contains at least one metal selected from the group consisting of cadmium, tin, bismuth, lead, indium, mercury and silver.  
     
     
         6 . The organic electronic component according to  claim 1 , wherein the metal alloy includes tin and indium.  
     
     
         7 . The organic electronic component according to  claim 1 , wherein the metal alloy includes tin and bismuth.  
     
     
         8 . The organic electronic component according to  claim 1 , wherein the metal alloy is a eutectic alloy.  
     
     
         9 . The organic electronic component according to  claim 1 , wherein the metal alloy includes a wetting agent.  
     
     
         10 . The organic electronic component according to  claim 1 , wherein the metal alloy includes an adhesion promoter.  
     
     
         11 . A method of manufacturing a device, comprising applying a molten metal alloy to form a cathode of an electronic component.  
     
     
         12 . The method according to  claim 11 , wherein applying the molten metal alloy includes a printing process.  
     
     
         13 . The method according to  claim 11 , wherein applying the molten metal alloy includes applying the molten metal alloy in an unstructured manner.  
     
     
         14 . The method of  claim 11 , further comprising depositing a powder.  
     
     
         15 . The method of  claim 11 , wherein applying a molten metal alloy to form a cathode includes applying the molten metal over one or more organic layers.  
     
     
         16 . A method of manufacturing a device, comprising applying a fusible alloy with an embossing technique to form a cathode of an electrical component.