Socket for testing a semiconductor device and a connecting sheet used for the same

Abstract

Probes 1 for testing and outer connecting terminals 14 a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202 , flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.

1 . A test socket for testing electrical characteristics of a semiconductor device by connecting probes, arranged in a grid-like form, with outer connecting terminals of the semiconductor device, arranged in a grid-like form, and electrically connecting the probes with the outer connecting terminals comprising: 
 a connecting sheet, made of an elastically deformative insulating material, and having electrodes for electrically connecting the probes to the outer connecting terminals of the semiconductor device; and    a guiding member having holes at positions corresponding to the outer connecting terminals of the semiconductor device and overlapping the connecting sheet.    
   
   
       2 . A test socket having a circuit board, which transmits an electrical signal for testing electrical characteristics of a semiconductor device to outer connecting terminals of the semiconductor device, arranged in a grid-like form, and receives the electrical signal from the outer connecting terminals, and transmits the electrical signal to a testing equipment and receives the electrical signal from the testing equipment, comprising: 
 a connecting sheet, made of an elastically deformative insulating member and having electrodes for electrically connecting the circuit board with the outer connecting terminals of the semiconductor device; and    a guiding member having holes at positions corresponding to the outer connecting terminals of the semiconductor device and overlapping the connecting sheet.    
   
   
       3 . The test socket according to  claim 1 , 
 wherein the electrodes of the connecting sheet, being in contact with the outer connecting terminals of the semiconductor device, have a spaced portion and a bending portion, and    the bending portion is in contact with the outer connecting terminal of the semiconductor device.    
   
   
       4 . The test socket according to  claim 2 , 
 wherein the electrodes of the connecting sheet, being in contact with the outer connecting terminals of the semiconductor device, have a spaced portion and a bending portion, and    the bending portion is in contact with the outer connecting terminal of the semiconductor device.    
   
   
       5 . The test socket according to  claim 1 , 
 wherein a through hole is formed in a part of the connecting sheet.    
   
   
       6 . The test socket according to  claim 2 , 
 wherein a through hole is formed in a part of the connecting sheet.