Apparatus and method for processing substrate

Abstract

An apparatus and a method for processing substrate are generally used for apparatuses for wet-type process of substrate, such as an electrolytic processing apparatus for use in forming interconnects by embedding a metal such as copper (Cu) or the like in fine interconnect patterns (recesses) that are formed in a substrate such as a semiconductor wafer and for use in forming bumps for electrical connections. The substrate processing apparatus includes: a substrate holder for holding a substrate; a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate; a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode, wherein the substrate holder is designed to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.

1 . A substrate processing apparatus comprising: 
 a substrate holder for holding a substrate;    a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate;    a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and    a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode;    wherein the substrate holder is adapted to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.    
   
   
       2 . The substrate processing apparatus according to  claim 1 , wherein a high-resistance structure having a higher electric resistance than the processing liquid is disposed between the substrate held by the substrate holder and the second electrode.  
   
   
       3 . The substrate processing apparatus according to  claim 1 , wherein the substrate processing apparatus is an electroplating apparatus in which the first electrode serves as a cathode and the second electrode serves as an anode, and the processing liquid is a plating solution.  
   
   
       4 . A substrate processing apparatus comprising: 
 a substrate holder for holding a substrate;    a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate;    a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder;    a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode; and    a vibrating mechanism for vibrating the substrate held by the substrate holder.    
   
   
       5 . The substrate processing apparatus according to  claim 4 , wherein the vibrating mechanism is comprised of a vibration exciter for vibrating the substrate holder.  
   
   
       6 . The substrate processing apparatus according to  claim 4 , wherein the vibrating mechanism is comprised of an ultrasonic transducer which transmits ultrasonic waves to the substrate, held by the substrate holder, through its contact with the back surface of the substrate.  
   
   
       7 . The substrate processing apparatus according to  claim 4 , wherein the vibrating mechanism is comprised of an ultrasonic transducer which transmits ultrasonic waves to the substrate, held by the substrate holder, in a contactless manner.  
   
   
       8 . The substrate processing apparatus according to  claim 4 , wherein a high-resistance structure having a higher electric resistance than the processing liquid is disposed between the substrate held by the substrate holder and the second electrode.  
   
   
       9 . The substrate processing apparatus according to  claim 4 , wherein the substrate processing apparatus is an electroplating apparatus in which the first electrode serves as a cathode and the second electrode serves as an anode, and the processing liquid is a plating solution.  
   
   
       10 . A substrate processing apparatus comprising: 
 a substrate holder for holding a substrate;    a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate;    a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder;    a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode; and    a vibrating mechanism for vibrating the second electrode.    
   
   
       11 . The substrate processing apparatus according to  claim 10 , wherein the vibrating mechanism is comprised of a vibration exciter for vibrating the second electrode in the vertical direction.  
   
   
       12 . The substrate processing apparatus according to  claim 10 , wherein a high-resistance structure having a higher electric resistance than the processing liquid is disposed between the substrate held by the substrate holder and the second electrode.  
   
   
       13 . The substrate processing apparatus according to  claim 10 , wherein the substrate processing apparatus is an electroplating apparatus in which the first electrode serves as a cathode and the second electrode serves as an anode, and the processing liquid is a plating solution.  
   
   
       14 . A substrate processing apparatus comprising: 
 a substrate holder for holding a substrate; and    a processing liquid supply section for supplying a processing liquid to a processing surface of the substrate held by the substrate holder;    wherein the substrate holder is adapted to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.    
   
   
       15 . A substrate processing apparatus comprising: 
 a substrate holder for holding a substrate;    a processing liquid supply section for supplying a processing liquid to a processing surface of the substrate held by the substrate holder; and    a vibrating mechanism for vibrating the substrate held by the substrate holder.    
   
   
       16 . The substrate processing apparatus according to  claim 15 , wherein the vibrating mechanism is comprised of a vibration exciter for vibrating the substrate holder.  
   
   
       17 . The substrate processing apparatus according to  claim 15 , wherein the vibrating mechanism is comprised of an ultrasonic transducer which transmits ultrasonic waves to the substrate, held by the substrate holder, through its contact with the back surface of the substrate.  
   
   
       18 . The substrate processing apparatus according to  claim 15 , wherein the vibrating mechanism is comprised of an ultrasonic transducer which transmits ultrasonic waves to the substrate, held by the substrate holder, in a contactless manner.  
   
   
       19 . A substrate processing method comprising: 
 filling a space between a processing surface of a substrate, to which electricity is supplied from a first electrode, and a second electrode disposed so as to face the processing surface with an electrolytic liquid; and    electrolytically processing the processing surface by applying a voltage between the first electrode and the second electrode while rotating the substrate in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.    
   
   
       20 . A substrate processing method comprising: 
 filling a space between a processing surface of a substrate, to which electricity is supplied from a first electrode, and a second electrode disposed so as to face the processing surface with an electrolytic liquid; and    electrolytically processing the processing surface by applying a voltage between the first electrode and the second electrode while vibrating at least one of the substrate and the second electrode.    
   
   
       21 . A substrate processing method comprising; 
 supplying a processing liquid to a processing surface of a substrate; and    processing the processing surface while rotating the substrate in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.    
   
   
       22 . A substrate processing method comprising; 
 supplying a processing liquid to a processing surface of a substrate; and    processing the processing surface while vibrating the substrate.