US2005145365A1PendingUtilityA1

Guide flow heat sink

Priority: Dec 24, 2003Filed: Dec 24, 2003Published: Jul 7, 2005
Est. expiryDec 24, 2023(expired)· nominal 20-yr term from priority
Inventors:Hung-Shen Chang
H10W 40/43H05K 7/20172F28F 13/00
33
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A heat sink includes a heatsink board, and a cooling fan. The heatsink board includes a top plate, a bottom plate, and a plurality of separation plates forming a plurality of guide layers between the top plate, the separation plates and the bottom plate. Each of the guide layers is formed with a plurality of hollow flow channels. Thus, each of the flow channels provides an air guide effect, and the cooling fan provides a force convection effect, so that the heat of the heat source absorbed by the top plate and the bottom plate is carried away and is drained outward from the heatsink board, thereby enhancing the heat dissipation effect of the heat sink.

Claims

exact text as granted — not AI-modified
1 . A heat sink, comprising: 
 a heatsink board including a top plate, a bottom plate, a plurality of separation plates mounted between the top plate and the bottom plate to form a plurality of guide layers between the top plate, the separation plates and the bottom plate, and each of the guide layers being formed with a plurality of hollow flow channels.    
   
   
       2 . The heat sink in accordance with  claim 1 , wherein the top plate contacts a heat source to absorb heat produced by the heat source.  
   
   
       3 . The heat sink in accordance with  claim 1 , wherein the bottom plate contacts a heat source to absorb heat produced by the heat source.  
   
   
       4 . The heat sink in accordance with  claim 1 , further comprising a cooling fan mounted in the heatsink board.  
   
   
       5 . The heat sink in accordance with  claim 4 , wherein the top plate  10  is formed with an air vent, and the heatsink board includes a hollow receiving chamber formed between the guide layers and between the flow channels to connect each of the flow channels of each of the guide layers, and the cooling fan is mounted on one of the separation plates and is located in the receiving chamber.  
   
   
       6 . The heat sink in accordance with  claim 5 , wherein the receiving chamber communicates with the air vent to connect the air vent to each of the flow channels of each of the guide layers.  
   
   
       7 . The heat sink in accordance with  claim 5 , wherein the air vent of the top plate is closed.  
   
   
       8 . The heat sink in accordance with  claim 1 , further comprising a cooling fan mounted on a side of the heatsink board.  
   
   
       9 . The heat sink in accordance with  claim 8 , wherein the heatsink board includes a guide hood mounted on a side of the heatsink board, and the cooling fan is mounted in the guide hood.  
   
   
       10 . The heat sink in accordance with  claim 9 , wherein the guide hood is formed with a receiving space connected to each of the flow channels of each of the guide layers.

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