CTE-matched heat pipe

Abstract

Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

1 . A heat transfer device comprising: 
 at least one wall comprising a layered-composite comprising a first layer of material comprising a CTE that is substantially similar to a CTE of silicon disposed between and directly engaging second layers of material comprising CTE greater than said silicon CTE.    
     
     
         2 . A heat transfer device according to  claim 1  wherein said first layer comprises molybdenum and said second layers comprise OFE copper foil.  
     
     
         3 . A heat transfer device according to  claim 1  wherein said first layer comprises a CTE of about  10  or less.  
     
     
         4 . A heat transfer device according to  claim 1  wherein said first layer comprises a CTE of about 6.5 or less.  
     
     
         5 . A heat transfer device according to  claim 1  wherein said first layer is selected from the group consisting of aluminum nitride, molybdenum, and graphite.  
     
     
         6 . A heat transfer device according to  claim 1  wherein said second layers are selected from the group consisting of copper, copper alloys, nickel, and nickel alloys.  
     
     
         7 . A heat transfer device according to  claim 1  wherein said second layers are the same material.  
     
     
         8 . A heat transfer device according to  claim 1  wherein said layered-composite is selected from the group consisting of copper/aluminum nitride/copper, copper/molybdenum/copper, and copper/graphite/copper.  
     
     
         9 . A heat transfer device comprising: 
 a base defining a through-opening; and    a layered-composite insert hermetically received within said through-opening so as to be thermally and mechanically engaged with said base and thereby to close said through-opening, wherein said layered composite insert comprises a layer of molybdenum disposed between and directly engaging layers of OFE copper.    
     
     
         10 . A heat pipe comprising: 
 a body having an interior wall that defines a central passageway and at least one open end;    a wick disposed on at least a portion of said interior wall;    a working fluid;    a layered-composite base that hermetically seals said at least one open end of said central passageway, wherein said layered composite base comprises a first layer of material comprising a CTE that is substantially similar to a CTE of silicon disposed between and directly engaging second layers of material comprising CTE greater than said silicon CTE.    
     
     
         11 . A heat transfer device according to  claim 10  wherein said first layer comprises molybdenum and said second layers comprise OFE copper foil.  
     
     
         12 . A heat transfer device according to  claim 10  wherein said first layer comprises a CTE of about 10 or less.  
     
     
         13 . A heat transfer device according to  claim 10  wherein said first layer comprises a CTE of about 6.5 or less.  
     
     
         14 . A heat transfer device according to  claim 10  wherein said first layer is selected from the group consisting of aluminum nitride, molybdenum, and graphite.  
     
     
         15 . A heat transfer device according to  claim 10  wherein said second layers are selected from the group consisting of copper, copper alloys, nickel, and nickel alloys.  
     
     
         16 . A heat transfer device according to  claim 10  wherein said second layers are the same material.  
     
     
         17 . A heat transfer device according to  claim 10  wherein said layered-composite is selected from the group consisting of copper/aluminum nitride/copper, copper/molybdenum/copper, and copper/graphite/copper.  
     
     
         18 . A heat pipe comprising: 
 a tubular body having a central passageway;    a wick disposed on at least an evaporator portion of said central passageway;    a working fluid;    a layered composite low CTE base sealing off said evaporator portion of said central passageway, wherein said layered composite low CTE base comprises a layer of material selected from the group consisting of aluminum nitride, molybdenum, and graphite, and having a top surface and a bottom surface comprising a material selected from the group consisting of copper, copper alloys, nickel, and nickel alloys.    
     
     
         19 . A heat pipe comprising: 
 a body defining an interior a chamber and including at least one wall comprising a layered-composite comprising a first layer of material comprising a CTE that is substantially similar to a CTE of silicon disposed between and directly engaging second layers of material comprising CTE greater than said silicon CTE;    a wick disposed on portions of said body that define said interior chamber; and    a working fluid.    
     
     
         20 . A heat transfer device according to  claim 19  wherein said first layer comprises molybdenum and said second layers comprise OFE copper foil.  
     
     
         21 . A heat transfer device according to  claim 19  wherein said first layer comprises a CTE of about 10 or less.  
     
     
         22 . A heat transfer device according to  claim 19  wherein said first layer comprises a CTE of about 6.5 or less.  
     
     
         23 . A heat transfer device according to  claim 19  wherein said first layer is selected from the group consisting of aluminum nitride, molybdenum, and graphite.  
     
     
         24 . A heat transfer device according to  claim 19  wherein said second layers are selected from the group consisting of copper, copper alloys, nickel, and nickel alloys.  
     
     
         25 . A heat transfer device according to  claim 19  wherein said second layers are the same material.  
     
     
         26 . A heat transfer device according to  claim 19  wherein said layered-composite is selected from the group consisting of copper/aluminum nitride/copper, copper/molybdenum/copper, and copper/graphite/copper.  
     
     
         27 . A heat pipe comprising: 
 a body defining an interior a chamber and including at least one wall comprising a layered-composite of molybdenum disposed between layers of OFE copper foil;    a wick disposed on portions of said body that define said interior chamber; and    a working fluid.    
     
     
         28 . A heat pipe for spreading heat comprising: 
 a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber wherein said first and second plates have a wick disposed upon their interior surfaces that define said chamber;    an opening defined through said first plate;    a layered-composite insert positioned within and hermetically sealing said opening so as to be thermally and mechanically engaged with said first plate, wherein said layered composite insert comprises a layer of molybdenum disposed between and directly engaging layers of OFE copper foil; and    a working fluid.    
     
     
         29 . A heat pipe for spreading heat comprising: 
 a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber;    an opening defined through said first plate;    a layered-composite insert positioned within and hermetically sealing said opening so as to be thermally and mechanically engaged with said first plate, wherein said layered composite insert comprises a layer of molybdenum disposed between and directly engaging layers of OFE copper foil;    a wick disposed on interior portions of at least one of said first and second plates; and a working fluid.