US2005139630A1PendingUtilityA1

IC tag with sealing tool

Assignee: JAPAN BANOK CO LTDPriority: Dec 25, 2003Filed: Dec 10, 2004Published: Jun 30, 2005
Est. expiryDec 25, 2023(expired)· nominal 20-yr term from priority
G06K 19/07758G06K 19/077G09F 3/14
43
PatentIndex Score
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Cited by
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References
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Claims

Abstract

To provide an IC tag 11 permitting to easily attach the IC tag part to an article. An IC tag with a sealing tool wherein it is molded of synthetic resin in one body, and the tag part 11 with an embedded IC chip 12 a is connected to the sealing tool 1 provided with a male part 5 having an insertion head part and a female part 6 having an insertion hole 6 b to be engaged with the insertion head part 5 at both end parts of filament parts 3, 4 , respectively, through a connection part 9 which can be manually separated.

Claims

exact text as granted — not AI-modified
1 . An IC tag with a sealing tool, said sealing tool, integrally molded of synthetic resin, comprising a filament part provided with a male part having an insertion head part at one end part and a female part having an insertion hole to be engaged with the insertion head part at the other end part respectively, characterized in that a tag part with an embedded IC chip is connected to said sealing tool through a connection part which can be manually separated.  
   
   
       2 . An IC tag with a sealing tool as claimed in  claim 1 , characterized in that the filament is straight and the vicinity of the female part is connected to the connection part.  
   
   
       3 . An IC tag with a sealing tool, said sealing tool, integrally molded of synthetic resin, comprising a bend part and two pieces of filament parts of almost the same length extended from both ends of the bend part, said filament parts being provided with a male part having an insertion head part at an end part of one filament part and a female part having an insertion hole to be engaged with the insertion head part at an end part of the other filament part respectively, and further characterized in that said IC tag part with an embedded IC chip is connected to the bend part through a connection part which can be manually separated.  
   
   
       4 . An IC tag with a sealing tool as claimed in  claim 3 , characterized in that the bend part is shaped like a letter U, V, or a round.  
   
   
       5 . An IC tag with a sealing tool as claimed in any of  claims 1  to  3 , characterized in that the connection part can be torn off by twisting action.  
   
   
       6 . An IC tag with a sealing tool as claimed in any of  claims 1  to  3 , characterized in that the connection part is formed into one or more threads, and said tag part can be separated by twisting action applied thereto.  
   
   
       7 . An IC tag with a sealing tool as claimed in any of  claims 1  to  3 , characterized in that the connection part is formed like a thin plate, and said IC tag part is connected to the connection part so as to be separable.  
   
   
       8 . An IC tag with a sealing tool as claimed in any of  claims 1  to  3 , characterized in that a part of the connection part is diminished in cross section, and said IC tag part with an embedded IC can be separated by applying twisting action to this part.

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