Method of mounting electronic component on substrate without generation of voids in bonding material

Abstract

When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

1 - 13 . (canceled)  
   
   
       14 . An electronic circuit board comprising: 
 a substrate;    an electronic component mounted on a surface of the substrate and having a terminal conductor received on a terminal pad on the substrate; and    a thermoplastic resin material interposed between the substrate and the electronic component.    
   
   
       15 . The electronic circuit board according to  claim 14 , wherein said thermoplastic resin material has a higher heat conductivity.  
   
   
       16 . An electronic component unit comprising: 
 a terminal conductor of a predetermined height standing on a surface opposed to a substrate; and    a solid support standing on the surface, said solid support having a height larger than the predetermined height.    
   
   
       17 . The electronic component unit according to  claim 16 , wherein said solid support is made of a thermoplastic resin material.  
   
   
       18 . The electronic component unit according to  claim 16 , wherein said solid support has an adherent property on its surface.  
   
   
       19 . The electronic component unit according to  claim 16 , wherein said thermoplastic resin material has a higher heat conductivity.