Fluid supply nozzle, substrate processing apparatus and substrate processing method

Abstract

A fluid supply nozzle includes a fluid flow-in section into which a fluid flows in, a reservoir section for storing the fluid, a flow velocity control wall provided between the fluid flow-in section and the reservoir section and including an orifice for making the fluid flow in the reservoir section while reducing a flow velocity, and a discharging section including a slit for discharging the fluid with pressure of the fluid applied to the reservoir section. A substrate processing apparatus is formed so as to include the fluid supply nozzle. Moreover, a substrate processing method includes the step of discharging a fluid in a single-layered, continuous film to supply the fluid onto a substrate. Thus, the substrate is processed. To perform this method, the fluid supply nozzle of the present invention can be used.

1 . A fluid supply nozzle comprising: 
 a fluid flow-in section into which a fluid flows in;    a reservoir section, connected to the fluid flow-in section, for storing the fluid;    a flow velocity control wall provided between the fluid flow-in section and the reservoir section and including an orifice for passing the fluid therethrough while reducing a flow velocity; and    a discharging section connected to the reservoir section and including a slit for discharging the fluid with pressure of the fluid which has passed through the orifice.    
   
   
       2 . The fluid supply nozzle of  claim 1 , wherein the slit has an opening plane with the ratio of a length of the slit to a width of the slit is 10 or more.  
   
   
       3 . The fluid supply nozzle of  claim 1 , wherein a cross section of the reservoir section taken along the perpendicular direction to the length direction of the opening plane of the slit has a shape with part expanding toward an opposing side to the flow velocity control wall with respect to a straight line joining a contact point between an inner wall of the reservoir section and the flow velocity control wall and a contact point between the inner wall of the reservoir section and the slit.  
   
   
       4 . The fluid supply nozzle of  claim 1 , wherein a cross section of the reservoir section taken along the perpendicular direction to the length direction of the opening plane of the slit has a shape with part bulging toward an opposing side to the flow velocity control wall with respect to a line joining a contact point between an inner wall of the reservoir section and the flow velocity control wall and a contact point between the inner wall of the reservoir section and the slit.  
   
   
       5 . The fluid supply nozzle of  claim 1 , wherein the fluid is discharged through the slit in the direction making an angle with a center axis of the fluid supply nozzle.  
   
   
       6 . A substrate processing apparatus comprising: 
 the fluid supply nozzle of  claim 1;  and    a flow rate control section for controlling a flow rate of a fluid flowing into the fluid supply nozzle,    wherein the fluid is supplied from the fluid supply nozzle to the substrate, and    wherein the length direction of an opening of the slit is substantially parallel to the substrate.    
   
   
       7 . A substrate processing method in which a fluid is supplied onto a substrate to perform processing of the substrate, 
 wherein the fluid is supplied in a continuous film shape to the substrate, and    wherein when the fluid is in contact with the substrate, a flow rate of the fluid is uniform at each contact part of the substrate with the fluid.    
   
   
       8 . A substrate processing method in which a fluid is supplied onto a substrate to perform processing of the substrate, 
 wherein the fluid is supplied in a continuous film shape using the fluid supply nozzle of  claim 1 , and    wherein, when the fluid is in contact with the substrate, a flow rate of the fluid at each contact part of the substrate with the fluid is uniform.    
   
   
       9 . The substrate processing method of  claim 7 , wherein a pattern having a width of 0.13 μm or less and an aspect ratio of 2.5 or more is formed on the substrate.