US2005138874A1PendingUtilityA1

Temporary protective covers

Assignee: CARDINAL CG COPriority: Sep 11, 2000Filed: Dec 22, 2004Published: Jun 30, 2005
Est. expirySep 11, 2020(expired)· nominal 20-yr term from priority
C23C 14/568C03C 2218/154C03C 17/245C03C 2218/355C03C 17/3417C03C 2217/229C03C 2217/216C23C 14/086
51
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Claims

Abstract

A substrate carrying a temporary protective cover and related methods of producing and processing substrates are described. In one embodiment, a substrate has a durable exterior surface bearing a temporary protective cover that protects the durable surface against contamination but that can readily be readily removed from the durable surface by washing with a given washing fluid.

Claims

exact text as granted — not AI-modified
1 - 53 . (canceled)  
     
     
         54 . A method of producing substrates, the method comprising: 
 a) providing a substrate having generally-opposed interior and exterior surfaces;    b) forming a durable coating upon the exterior surface of the substrate, said coating comprising material that is durable to a selected washing fluid; and    c) sputtering a temporary protective cover over the durable coating, the cover comprising material that protects the durable coating against contamination but that can readily be removed by washing with the selected washing fluid.    
     
     
         55 . The method of  claim 54  wherein the durable coating is formed by sputtering.  
     
     
         56 . The method of  claim 54  wherein the durable coating is a hydrophilic coating deposited by sputtering a silicon target in an oxidizing atmosphere.  
     
     
         57 . The method of  claim 54  wherein the durable coating is a photocatalytic coating depositing by sputtering a titanium-containing target.  
     
     
         58 . The method of  claim 54  wherein the temporary protective cover is formed by sputtering upon the durable coating an oxide of a metal selected from the group consisting of zinc, bismuth, cadmium, iron, and nickel.  
     
     
         59 . The method of  claim 54  wherein the temporary protective cover is durable to elevated temperatures on the order of about 600° C., the method further comprising tempering the covered substrate.  
     
     
         60 . The method of  claim 54  further comprising incorporating the covered substrate into an insulating glass unit.  
     
     
         61 . The method of  claim 54  further comprising delivering the covered substrate to a customer.  
     
     
         62 . The method of  claim 54  further comprising installing the covered substrate in a window frame.  
     
     
         63 . A method of processing substrates, the method comprising: 
 a) providing a substrate having an exterior surface that is durable to a selected washing fluid, the exterior surface carrying a temporary protective cover comprising a sputtered film that protects the exterior surface against contamination but that can readily be removed from the exterior surface by washing with the selected washing fluid; and    b) washing the covered exterior surface of the substrate with the selected washing fluid to remove at least a portion of the cover, thereby exposing at least a portion of the underlying exterior surface.    
     
     
         64 . The method of  claim 63  wherein said washing fluid comprises a mild acid or a mild base.  
     
     
         65 . The method of  claim 64  wherein said washing fluid comprises vinegar.  
     
     
         66 . The method of  claim 65  wherein said washing removes substantially the entire cover.  
     
     
         67 . The method of  claim 66  further comprising incorporating the covered substrate into an insulating glass unit prior to said washing step.  
     
     
         68 . The method of  claim 66  further comprising delivering the covered substrate to a customer prior to said washing step.  
     
     
         69 . The method of  claim 66  further comprising installing the covered substrate in a window frame prior to said washing step.  
     
     
         70 . The method of  claim 66  wherein the cover is durable to elevated temperatures on the order of about 600° C., the method further comprising tempering the covered substrate.  
     
     
         71 . (canceled)  
     
     
         72 . (canceled)  
     
     
         73 . A method of processing substrates, the method comprising: 
 a) providing a substrate having an interior surface and an exterior surface and a sputtering line comprising a series of connected sputtering chambers, each chamber having a substrate support positioned therein, a first sputtering chamber comprising a first lower target positioned below the support in the first chamber, a second sputtering chamber comprising a second lower target positioned below the support in the second chamber;    b) positioning the substrate on the support in the first sputtering chamber such that the exterior surface of the substrate is oriented toward the first lower target, and sputtering the first lower target to deposit a first coating onto the exterior surface of the substrate, the first coating comprising material that is durable to a selected washing fluid; and    c) positioning the substrate on the support in the second sputtering chamber such that the exterior surface is oriented toward the second lower target, and sputtering the second lower target to deposit a second coating onto the first coating, the second coating comprising material that can readily be removed from the first coating by washing with the selected washing fluid.    
     
     
         74 . The method of  claim 73  wherein the first coating is a hydrophilic coating and the first lower target comprises silicon, wherein the first lower target is sputtered in an oxidizing atmosphere.  
     
     
         75 . The method of  claim 73  wherein the first coating is a photocatalytic coating and the first lower target comprises titanium, wherein the first lower target is sputtered in an atmosphere comprising inert gas or inert gas and oxygen.  
     
     
         76 . The method of  claim 73  wherein the second coating is a temporary protective cover and the second lower target comprises a metal, wherein the second lower target is sputtered in an oxidizing atmosphere.  
     
     
         77 . The method of  claim 73  wherein the second coating is a temporary protective cover and the second lower target comprises a metal selected from the group consisting of zinc, bismuth, cadmium, iron, and nickel, wherein the second lower target is sputtered in an oxidizing atmosphere.  
     
     
         78 . The method of  claim 73  wherein the second coating is a temporary protective cover and the second lower target comprises zinc, wherein the second lower target is sputtered in an oxidizing atmosphere.  
     
     
         79 . The method of  claim 73  further comprising a downward sputtering chamber having an upper target positioned above the support therein, the upper target being sputtered to deposit an interior coating on the interior surface of the substrate or on a film previously deposited upon the interior surface.  
     
     
         80 . The method of  claim 79  wherein the interior coating is low-emissivity coating or a film forming part of a low-emissivity coating and the upper target comprises a metal, wherein the upper target is sputtered in an oxidizing atmosphere.  
     
     
         81 . The method of  claim 73  further comprising a dual-direction sputtering chamber having a second upper target positioned above the support therein and having a third lower target positioned below the support therein, the second upper target and the third lower target being sputtered at substantially the same time.

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