Electroetching methods and systems using chemical and mechanical influence

Abstract

The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material. Such intermediate particulates do not contaminate, and thus allow for more efficient material removal, as well as plating to occur within the same chamber, if desired.

1 . A method of electrochemically removing a conductor of a top conductive surface of a workpiece, the method comprising the steps of: 
 applying an electrochemical etching solution to the top conductive surface of the workpiece in the presence of a current, thereby causing a portion of the top conductive surface to form into an intermediate compound, the intermediate compound being more easily mechanically removed from the top conductive surface than the portion of the top conductive surface; and    mechanically removing at least a portion of the intermediate compound from the top conductive surface.