Method of producing electrodeposited antennas for RF ID tags by means of selectively introduced adhesive

Abstract

A method is described for producing a structured metal layer used, for example, as an antenna for RF ID tags. The structured metal layer is electrodeposited on a cathode, on the surface of which conducting and non-conducting regions are defined. Applied to the deposited metal layer in a residual volume is an adhesive with which the structured metal layer can be made to adhere firmly on a carrier layer.

1 . A method of producing a structured metal layer, comprising: 
 providing a cathode with conducting and nonconducting regions which form a mask structure on the surface of the cathode;    providing an anode and arranging the cathode and the anode in an electrolyte which comprises a substrate metal;    applying a voltage between the cathode and the anode;    depositing the substrate metal onto the conducting regions of the cathode;    providing a carrier layer and bringing the carrier layer into contact with the surface of the cathode; and    transferring the substrate metal deposited onto the cathode to the carrier layer, the structured metal layer being obtained.    
     
     
         2 . The method as claimed in  claim 1 , wherein the cathode includes a cylindrical geometry.  
     
     
         3 . The method as claimed in  claim 1 , wherein the conducting regions of the cathode are constructed from high-grade steel.  
     
     
         4 . The method as claimed in  claim 1 , wherein the nonconducting regions of the cathode comprise a plastic and/or a ceramic.  
     
     
         5 . The method as claimed in  claim 1 , wherein the conducting regions of the cathode surface are arranged in the form of an antenna structure.  
     
     
         6 . The method as claimed in  claim 1 , wherein the anode comprises the substrate metal.  
     
     
         7 . The method as claimed in  claim 6 , wherein the substrate metal includes copper.  
     
     
         8 . The method as claimed in  claim 1 , wherein the depositing of the substrate metal is controlled such that the layer thickness of the structured metal layer is less than the depth of the mask structure, thereby forming a residual volume.  
     
     
         9 . The method as claimed in  claim 8 , further comprising applying an adhesive to the structured metal layer in the residual volume.  
     
     
         10 . The method as claimed in  claim 9 , wherein the adhesive includes a thermoplastic adhesive or a reaction adhesive.  
     
     
         11 . The method as claimed in  claim 1 , wherein the electrolyte comprises sulfuric acid and copper sulfate.  
     
     
         12 . The method as claimed in  claim 1 , wherein the structured metal layer is supplemented by a microchip to form an RF ID tag after transfer of the substrate metal deposited onto the cathode to the carrier layer.