Mask handler apparatus

Abstract

Method and apparatus for supporting a substrate in a semiconductor substrate processing system are provided. A substrate is supported on two substrate support each having an inclined surface for receiving a portion of the substrate while minimizing contact with the substrate and guides for centering the substrate on the inclined surface. In one aspect, the two substrate supports are position facing each other on a ring disposed in a loadlock chamber with the substrate supported therebetween. Multiple sets of the substrate supports may be used to hold multiple substrates at a time in the loadlock chamber.

1 . An apparatus for supporting a substrate, comprising: 
 a base plate having an inner perimeter and an outer perimeter;    a substrate support member extending horizontally from the inner perimeter of the base plate;    at least one substrate support guide extending horizontally from the inner perimeter of the base plate and disposed adjacent the substrate support member, wherein the substrate support member and the at least one substrate support guide are adapted to receive a portion of a substrate.    
   
   
       2 . The apparatus of  claim 1 , wherein the substrate support member comprises a linear surface extending a length of the inner perimeter and the linear surface comprises an angular portion having an upper portion, a lower portion, and at least a partial tapered portion disposed between the upper portion and the lower portion.  
   
   
       3 . The apparatus of  claim 2 , wherein the lower portion has an inclined surface between about 2° and about 7°.  
   
   
       4 . The apparatus of  claim 3 , wherein the lower portion has an inclined surface of about 2.5°.  
   
   
       5 . The apparatus of  claim 2 , wherein the tapered portion has a angle from normal of between about 5° and about 60°.  
   
   
       6 . The apparatus of  claim 2 , wherein the linear surface further comprises one or more substantially normal portions having an upper portion, a substantially horizontal lower portion, and a substantially vertical portion disposed between the upper portion and substantially horizontal lower portion.  
   
   
       7 . The apparatus of  claim 5 , wherein the linear surface comprises a substantially normal portion disposed between two angular portions of the linear surface.  
   
   
       8 . The apparatus of  claim 2 , wherein the substrate support guides are disposed on the inner perimeter of the base plate and on at least opposing sides from the substrate support member.  
   
   
       9 . The apparatus of  claim 6 , wherein the substrate support guides are adapted to position a substrate on the substrate support member.  
   
   
       10 . The apparatus of  claim 1 , wherein the apparatus comprises an etch resistant material.  
   
   
       11 . An apparatus for supporting a substrate, comprising: 
 a ring;    a plurality of spacers disposed on the ring;    a plurality of substrate receiving members disposed on the plurality of spacers, wherein the substrate receiving members comprise: 
 a base plate having an inner perimeter and an outer perimeter;  
 a substrate support member extending horizontally from the inner perimeter of the base plate;  
 at least one substrate support guide extending horizontally from the inner perimeter of the base plate and disposed adjacent the substrate support member, wherein the substrate support member and the at least one substrate support guide are adapted to receive a portion of a substrate and the inner perimeter of the base plates are positioned to face an axis of the ring.  
   
   
   
       12 . The apparatus of  claim 11 , wherein the substrate support member comprises a linear surface extending a length of the inner perimeter and the linear surface comprises an angular portion having an upper portion, a lower portion, and at least a partial tapered portion disposed between the upper portion and the lower portion.  
   
   
       13 . The apparatus of  claim 12 , wherein the linear surface further comprises one or more substantially normal portions having an upper portion, a substantially horizontal lower portion, and a substantially vertical portion disposed between the upper portion and substantially horizontal lower portion.  
   
   
       14 . The apparatus of  claim 13 , wherein the linear surface comprises a substantially normal portion disposed between two angular portions of the linear surface having an upper portion, a lower portion, and at least a partial tapered portion disposed between the upper portion and the lower portion.  
   
   
       15 . The apparatus of  claim 12 , wherein the substrate support guides are disposed on the inner perimeter of the base plate and on at least opposing sides from the substrate support member.  
   
   
       16 . The apparatus of  claim 11 , wherein the ring comprises an etch resistant material.  
   
   
       17 . The apparatus of  claim 11 , wherein the at least two spacers are disposed on opposing sides of the ring from each other and a substrate receiving member is disposed on each of the at least two spaces, wherein the substrate support members of each substrate receiving member are opposed to each other.  
   
   
       18 . The apparatus of  claim 17 , wherein the apparatus comprises a first set of spacers disposed on opposing sides of the ring from each other with a first set of substrate receiving member facing an inward direction disposed on the first set of spaces and a second set of spacers disposed on the first set of substrate receiving members and a second set of substrate receiving members facing an inward direction disposed on the second set of spacers.  
   
   
       19 . The apparatus of  claim 18 , wherein the ring is adapted to be secured to a inner portion of a processing chamber.  
   
   
       20 . A loadlock chamber, comprising: 
 one or more walls defining an enclosure, the walls having a sealable loading port selectively sealable by a door and at least one substrate transfer slot selectively sealable by one or more slit valves, the substrate transfer slots disposed substantially opposite of the loading port;    at least one substrate support disposed in the enclosure, each substrate support comprising: 
 a ring;  
 a plurality of spacers disposed on the ring;  
 a plurality of substrate receiving members disposed on the plurality of spacers, wherein the substrate receiving members comprise: 
 a base plate having an inner perimeter and an outer perimeter;  
 a substrate support member extending horizontally from the inner perimeter of the base plate; and  
 at least one substrate support guide extending horizontally from the inner perimeter of the base plate and disposed adjacent the substrate support member, wherein the substrate support member and the at least one substrate support guide are adapted to receive a portion of a substrate and the inner perimeter of the base plates are position to face an axis of the ring.  
 
   
   
   
       21 . The loadlock chamber of  claim 20 , wherein the substrate support member comprises a linear surface extending a length of the inner perimeter and the linear surface comprises an angular portion having an upper portion, a lower portion, and at least a partial tapered portion disposed between the upper portion and the lower portion.  
   
   
       22 . The loadlock chamber of  claim 21 , wherein the linear surface further comprises one or more substantially normal portions having an upper portion, a substantially horizontal lower portion, and a substantially vertical portion disposed between the upper portion and substantially horizontal lower portion.  
   
   
       23 . The loadlock chamber of  claim 22 , wherein the linear surface comprises a substantially normal portion disposed between two angular portions of the linear surface having an upper portion, a lower portion, and at least a partial tapered portion disposed between the upper portion and the lower portion.  
   
   
       24 . The loadlock chamber of  claim 21 , wherein the substrate support guides are disposed on the inner perimeter of the base plate and on at least opposing sides from the substrate support member.  
   
   
       25 . The loadlock chamber of  claim 20 , wherein the ring comprises an etch resistant material.  
   
   
       26 . The loadlock chamber of  claim 20 , wherein the at least two spacers are disposed on opposing sides of the ring from each other and a substrate receiving member is disposed on each of the at least two spaces, wherein the substrate support members of each substrate receiving member are opposed to each other.  
   
   
       27 . The loadlock chamber of  claim 26 , wherein the apparatus comprises a first set of spacers disposed on opposing sides of the ring from each other with a first set of substrate receiving member facing an inward direction disposed on the first set of spaces and a second set of spacers disposed on the first set of substrate receiving members and a second set of substrate receiving members facing an inward direction disposed on the second set of spacers.  
   
   
       28 . The loadlock chamber of  claim 27 , wherein the ring is adapted to be secured to a inner portion of a processing chamber.  
   
   
       29 . The loadlock chamber of  claim 20 , further comprising: 
 a transfer chamber coupled to the loadlock chamber;    at least one processing chamber coupled to the transfer chamber:    a substrate handler disposed in the transfer chamber and in substrate communication with the loadlock and each of the at least one processing chamber.