Temperature controller system for controlling temperature of an object and an apparatus including same
Abstract
A temperature controller includes a bath for containing a refrigerant. One cooling line has one end connected to the bath and the other end branching off into a plurality of diverged lines. The first diverged line is connected to an edge portion of an object. The second diverged line is connected to a middle portion of the object. The third diverged line is connected to a central portion of the object. A plurality of valves for controlling flux of the refrigerant are mounted on inlets of the plurality of diverged lines, respectively. A plurality of temperature sensors for detecting temperatures of the refrigerant are mounted on outlets of the plurality of diverged lines, respectively. A controller controls opening angles of the plurality of valves in accordance with the detected temperatures of the refrigerant.
Claims
exact text as granted — not AI-modified1 . A temperature controller system for controlling the temperature of an object, the system comprising:
a refrigerant bath for containing a refrigerant; a cooling line having a first end connected to the refrigerant bath and a second end opposite to the first end; a plurality of diverged lines connected at one end to the second end of the cooling line, and connected at the other end to the object; a plurality of valves respectively mounted on the plurality of diverged lines; a plurality of sensors for detecting temperatures of the refrigerant flowing through the plurality of diverged lines; and a controller for controlling opening angles of the valves in accordance with the temperatures of the refrigerant detected by the plurality of temperature sensors.
2 . The temperature controller system of claim 1 , wherein a first diverged line is connected to an edge portion of the object, a second diverged line is connected to a middle portion of the object, and a third diverged line is connected to a central portion of the object.
3 . The temperature controller system of claim 2 , wherein the first, second and third diverged lines are formed in concentric circles on the object.
4 . The temperature controller system of claim 1 , wherein the plurality of valves are respectively mounted on inlets of the plurality of diverged lines through which the refrigerant flows into the object.
5 . The temperature controller system of claim 1 , wherein the sensors are mounted respectively on outlets of the plurality of diverged lines, through which the refrigerant flows from the object.
6 . An etching apparatus comprising:
an etching chamber for introducing a reaction gas for forming a plasma therein; an electrostatic chuck disposed on a bottom face of the etching chamber for supporting a wafer thereon; and a temperature controller system including a refrigerant bath for containing a refrigerant, a cooling line having a fist end connected to the refrigerant bath and a second end opposite to the first end, a plurality of diverged lines connected at one end to the second end of the cooling line and connected at the other end to the electrostatic chuck, a plurality of valves respectively mounted on the plurality of diverged lines, a plurality of sensors for detecting temperatures of the refrigerant flowing through the plurality of diverged lines, and a controller for controlling opening angles of the valves in accordance with the temperatures of the refrigerant detected by the plurality of temperature sensors.
7 . The etching apparatus of claim 6 , wherein a first diverged line is connected to an edge portion of the electrostatic chuck, a second diverged line is connected to a middle portion of the electrostatic chuck, and a third diverged line is connected to a central portion of the electrostatic chuck.
8 . The etching apparatus of claim 7 , wherein the diverged lines are formed in concentric circles on the electrostatic chuck.
9 . The etching apparatus of claim 6 , wherein the plurality of valves are respectively mounted on inlets of the plurality of diverged lines.
10 . The etching apparatus of claim 6 , wherein the sensors are respectively mounted on outlets of the plurality of diverged lines.
11 . An etching apparatus comprising:
an etching chamber for introducing a reaction gas for forming a plasma threin; an electrostatic chuck disposed on a bottom face of the etching chamber for supporting a wafer thereon; an upper electrode disposed at an upper portion of the etching chamber, the upper electrode for applying a voltage to the reaction gas to form the plasma; a cooling plate for cooling the upper electrode; and a temperature controller system including a refrigerant bath for containing a refrigerant, a cooling line having a fist end connected to the refrigerant bath and a second end opposite to the first end, a plurality of diverged lines connected at one end to the second end of the cooling line and connected at the other end to the electrostatic chuck, a plurality of valves respectively mounted on the plurality of diverged lines, a plurality of sensors for detecting temperatures of the refrigerant flowing through the plurality of diverged lines, and a controller for controlling opening angles of the plurality of valves in accordance with the temperatures of the refrigerant detected by the plurality of temperature sensors.
12 . The etching apparatus of claim 11 , wherein a first diverged line is connected to an edge portion of the cooling plate, a second diverged line is connected to a middle portion of the cooling plate, and a third diverged line is connected to a central portion of the cooling plate.
13 . The etching apparatus of claim 12 , wherein the first, second and third diverged lines are formed in concentric circles on the cooling plate.
14 . The etching apparatus of claim 1 1 , wherein the plurality of valves are respectively mounted on inlets of the plurality of diverged lines, through which the refrigerant flows into the electrostatic chuck.
15 . The etching apparatus of claim 11 , wherein the sensors are respectively mounted on outlets of the plurality of diverged lines, through which the refrigerant flows from the object.
16 . An etching apparatus comprising:
an etching chamber for introducing a reaction gas for forming a plasma therein; an electrostatic chuck disposed on a bottom face of the etching chamber, the chuck for supporting a wafer thereon; a first temperature controller system for controlling a temperature of the electrostatic chuck; an upper electrode disposed at an upper portion of the etching chamber, the upper electrode for applying a voltage to the reaction gas to form the plasma; a cooling plate for cooling the upper electrode; and a second temperature controller system for controlling a temperature of the cooling plate, a temperature controller system including a refrigerant bath for containing a refrigerant, a cooling line having a fist end connected to the refrigerant bath and a second end opposite to the first end, a plurality of diverged lines connected at one end to the second end of the cooling line and connected at the other end to the electrostatic chuck, a plurality of valves respectively mounted on the plurality of diverged lines, a plurality of sensors for detecting temperatures of the refrigerant flowing through the plurality of diverged lines, and a controller for controlling opening angles of the plurality of valves in accordance with the temperatures of the refrigerant detected by the plurality of temperature sensors.
17 . The etching apparatus of claim 16 , wherein at least one first diverged line is connected to an edge portion of the electrostatic chuck and the cooling plate, respectively, at least one second diverged line is connected to a middle portion of the electrostatic chuck and the cooling plate, respectively, and at least one third diverged line is connected to a central portion of the electrostatic chuck and the cooling plate, respectively.
18 . The etching apparatus of claim 17 , wherein the first, second and third diverged lines are formed in concentric circles on the electrostatic chuck and the cooling plate.
19 . The etching apparatus of claim 16 , wherein the plurality of valves are respectively mounted on inlets of the plurality of diverged lines, through which the refrigerant flows into the electrostatic chuck.
20 . The etching apparatus of claim 16 , wherein the sensors are respectively mounted on outlets of the plurality of diverged lines, through which the refrigerant flows from the object.Join the waitlist — get patent alerts
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