Method and composition for treating substrates

Abstract

A method of treating substrates, such as wood, including the steps of applying an alkali silicate solution to one or more substrates and applying an alkali borate solution with boric oxide (B 2 O 3 ) content to the substrates. Substrates that have been treated using the present method include a borate-silicate polymer within the substrate. When the present substrates are wood, wood products, or green lumber, they may be used to build structures.

1 . A wood treatment method comprising: 
 applying an alkali silicate solution to one or more substrates; and    applying an alkali borate solution with boric oxide (B 2 O 3 ) content to the substrates,    wherein at least one of the alkali silicate solution and the alkali borate solution include a sealant composition, and    wherein at least one of the alkali silicate solution and the alkali borate solution include a wetting agent.    
     
     
         2 . The method of  claim 1 , wherein the alkali silicate solution (a) comprises 5 wt. % to 60 wt. % alkali silicate.  
     
     
         3 . The method of  claim 1 , wherein the alkali borate solution (b) comprises 0.1 wt. % to 20 wt. % alkali silicate.  
     
     
         4 . The method of  claim 1 , wherein the sealant composition comprises one or more selected from the group consisting of wax, paraffin, paraffin wax dispersed in mineral oil, wax in the form of micronized particles, a mixture of a cyclodimethylsiloxane fluid and a polydiorganosiloxane-polyo-xyalkylene copolymer, oxyalkalene polymers, pyridine containing polymers, amine modified polybutadienes, vinyl polymer latexes, styrene butadiene copolymers, hydrogenated styrene butadiene copolymers, thermosetting styrene butadiene copolymers, a styrene-butadiene rubber latex, styrene block copolymers, a moisture-curable silylated polyurethane prepolymer, a polyethylene wax, an organo silane, a water-based polymeric binder and a wax hydrophobic filler, and mixtures thereof.  
     
     
         5 . The method of  claim 1 , wherein the sealant composition is present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.1 wt. % to 20 wt.  
     
     
         6 . The method of  claim 1 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more of a bactericide, insecticide, or fungicide.  
     
     
         7 . The method of  claim 6 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more bactericides, insecticides, or fungicides selected from the group consisting of methyl paraben, propyl paraben, disodium cyanodithioimidocarbonate, methylene bis thiocyanate, isothiazolin, glutaraldehyde, dithiocarbamates, quaternary ammonium compounds, dibromonitrilopropionamide, dibromo dicyano butane, dodecylguanidine hydrochloride, organophosphate insecticides, organosulfur insecticides, carbamate insecticides, formamidine insecticides, dinitrophenol insecticides, organotin insecticides, pyrethroid insecticides, and nicotinoid insecticides.  
     
     
         8 . The method of  claim 6 , wherein the bactericides, insecticides, or fungicides are present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.01 wt. % to 10 wt. %.  
     
     
         9 . The method of  claim 1 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more rheology modifiers.  
     
     
         10 . The method of  claim 9 , wherein the rheology modifier is one or more selected from the group consisting of cellulosic agents, lignum, lignin, culmonol, acrylic thickeners, alkali swellable latexes, natural gums, and acrylamide-based thickeners.  
     
     
         11 . The method of  claim 9 , wherein the rheology modifier is present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.01 wt. % to 5 wt.  
     
     
         12 . The method of  claim 1 , wherein the wetting agent is one or more selected from the group consisting of metasodium silicate, anionic surfactants, cationic surfactants, amphoteric surfactants, zwitterionic surfactants, trisodium phosphate, and tetrasodium pyrophosphate.  
     
     
         13 . The method of  claim 1 , wherein the wetting agent is present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.01 wt. % to 10 wt. %.  
     
     
         14 . The method of  claim 1 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more coupling agents.  
     
     
         15 . The method of  claim 14 , wherein the coupling agent is one or more selected from the group consisting of glycol ethers, linear or branched C.sub.1-C.sub.12 alcohols, linear or branched C.sub.1-C.sub.12 acetates, alkali salts of alkyl, aryl, or alkylaryl sulfonates, betaine surfactants, fatty acids, ketones, and D-limonene.  
     
     
         16 . The method of  claim 14 , wherein the coupling agent is present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.01 wt. % to 20 wt.  
     
     
         17 . The method of  claim 1 , wherein the sodium silicate treatment solution comprises 67 to 84.2 wt. % water, 15 to 20 wt. % sodium silicate, 0 to 10 wt. % of a sealant composition, 0.1 to 2 wt. % of a wetting agent, 0.1 to 2 wt. % of a rheology modifier, 0.1 to 2 wt. % of an alkali borate, and 0 to 0.5 wt. % bactericide, insecticide, or fungicide.  
     
     
         18 . The method of  claim 17 , wherein the wetting agent is a mixture of trisodium phosphate and sodium metasilicate, the sealant composition is a styrene-butadiene copolymer, the rheology modifier is a mixture of lignum and culmonol, and the alkali borate is disodium octaborate tetrahydrate.  
     
     
         19 . A wood treatment method comprising: 
 placing a wood material in a pressure vessel;    applying a vacuum to the pressure vessel;    applying a borate solution with boric oxide (B 2 O 3 ) content to the substrates;    increasing pressure in the pressure vessel;    draining the borate solution from the pressure vessel;    contacting the wood material with an alkali silicate solution; and    increasing the pressure in the pressure vessel for providing treated wood, wherein at least one of the alkali silicate solution and the borate solution include a sealant composition, and wherein at least one of the alkali silicate solution and the borate solution include a wetting agent.    
     
     
         20 . The method of  claim 19 , further comprising drying the treated wood through the application of energy.  
     
     
         21 . The method of  claim 20 , further comprising: 
 applying pressure followed by an application of a vacuum;    repeating the pressure and vacuum steps; and    drying the treated wood through the application of energy.    
     
     
         22 . The method of  claim 20 , wherein the application of energy includes applying one or more of radiant heat, electrical current, microwaves, lasers, convection ovens, dehydration, and spot heating to high temperatures for short periods of time.  
     
     
         23 . A wood treatment method comprising: 
 applying an alkali silicate solution to one or more substrates; and    applying an alkali borate with boric oxide (B 2 O 3 ) content to the substrates, 31. wherein at least one of the alkali silicate solution and the alkali borate solution include a sealant composition.    
     
     
         24 . The method of  claim 23 , wherein the alkali silicate solution (a) comprises 5 wt. % to 60 wt. % alkali silicate.  
     
     
         25 . The method of  claim 23 , wherein the alkali borate solution (b) comprises 0.1 wt. % to 20 wt. % alkali silicate.  
     
     
         26 . The substrate of  claim 23 , wherein the sealant composition comprises one or more selected from the group consisting of wax, paraffin, paraffin wax dispersed in mineral oil, wax in the form of micronized particles, a mixture of a cyclodimethylsiloxane fluid and a polydiorganosiloxane-polyo-xyalkylene copolymer, oxyalkalene polymers, pyridine containing polymers, amine modified polybutadienes, vinyl polymer latexes, styrene butadiene copolymers, hydrogenated styrene butadiene copolymers, thermosetting styrene butadiene copolymers, a styrene-butadiene rubber latex, styrene block copolymers, a moisture-curable silylated polyurethane prepolymer, a polyethylene wax, an organo silane, a water-based polymeric binder and a wax hydrophobic filler, and mixtures thereof.  
     
     
         27 . The substrate of  claim 23 , wherein the sealant composition is present in one or both of the alkali silicate solution and the alkali borate solution at a level of from 0.1 wt. % to 20 wt. %.  
     
     
         28 . The substrate of  claim 23 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more of a bactericide, insecticide, or fungicide.  
     
     
         29 . The substrate of  claim 23 , wherein one or both of the alkali silicate solution and the alkali borate solution include one or more bactericides, insecticides, or fungicides selected from the group consisting of methyl paraben, propyl paraben, disodium cyanodithioimidocarbonate, methylene bis thiocyanate, isothiazolin, glutaraldehyde, dithiocarbamates, quaternary ammonium compounds, dibromonitrilopropionamide, dibromo dicyano butane, dodecylguanidine hydrochloride, organophosphate insecticides, organosulfur insecticides, carbamate insecticides, formamidine insecticides, dinitrophenol insecticides, organotin insecticides, pyrethroid insecticides, and nicotinoid insecticides.