US2005127431A1PendingUtilityA1

Quantum structure and forming method of the same

Assignee: UNITED MICROELECTRONICS CORPPriority: May 1, 2003Filed: Jan 13, 2005Published: Jun 16, 2005
Est. expiryMay 1, 2023(expired)· nominal 20-yr term from priority
H10D 64/01342H10D 64/0134H10D 64/691H10D 64/685H10D 64/035H10D 30/6893B82Y 10/00
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Claims

Abstract

A quantum structure and the forming method based on the difference in characteristic of two matters is provided. The forming method includes several steps. At first, providing a first dielectric layer for forming a second dielectric layer thereon. The second dielectric layer has major elements and impurities contained. Treating the second dielectric layer to drive the impurities to form the quantum structure. For example, oxidizing the major elements to drive the impurities in the first dielectric layer to form the quantum structure in said first dielectric layer because the oxidizing capability of the major elements is stronger than that of the impurities.

Claims

exact text as granted — not AI-modified
1 - 18 . (canceled)  
     
     
         19 . A non-volatile random access memory including quantum structure, comprising: 
 a semiconductor substrate including a source and a drain;    a dielectric layer, that is deposited on said semiconductor substrate, said dielectric layer including said quantum structure that are formed from an oxidizing process; and    a control gate formed on said dielectric layer.

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