Method of manufacturing electronic component and member to be used in the same method

Abstract

A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

1 - 29 . (canceled)  
   
   
       30 . Unbaked ceramic substrate including base layer which contains organic substance, of which thickness is not more than 20 μm on surface of the base layer, wherein the organic substance is burnt off by baking at a temperature not lower than 300° C.  
   
   
       31 . The unbaked ceramic substrate of  claim 30 , wherein the base layer includes one of metal powder and oxide powder in a quantity ranging from not less than 1 weight % to not more than 80 weight % and having a particle diameter ranging from not less than 0.001 μm to not more than 10 μm.  
   
   
       32 . The unbaked ceramic substrate of  claim 30 , wherein the base layer further includes carboxylic acid at least 0.01 weight %.  
   
   
       33 . Unbaked ceramic substrate including a component, which reacts on additive component of organic substance included in ink to cause gelling, at least 0.01 weight %, wherein the component is burnt off by baking at a temperature not lower than 300° C.  
   
   
       34 . Base layer including a component, which reacts on additive component of organic substance included in ink to cause gelling, at least 0.01 weight %, wherein the component is burnt off by baking at a temperature not lower than 300° C.  
   
   
       35 . The base layer as defined in  claim 34  having a thickness of not more than 20 μm and comprising material which includes one of metal powder and oxide powder, of which particle diameter ranges from not less than 0.001 μm to not more than 10 μm, in a quantity of at least 0.01 weight %.  
   
   
       36 . The base layer of  claim 34  including organic material, which is to be burnt off by baking, at least 0.1 weight %.