US2005124781A1PendingUtilityA1
Poly amic acid system for polyimides
Est. expiryFeb 16, 2021(expired)· nominal 20-yr term from priority
Inventors:Lisa Scott
Y10T428/31681C08G 73/1032C08G 73/1042H05K 1/0346Y10T428/31721Y10T428/31678
40
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Claims
Abstract
A poly amic acid precursor containing a combination of tetrahydrofuran and N-methylpyrrolidinone as cosolvents is described. Utilizing the combination of tetrahydrofuran and N-methylpyrrolidinone allows for the removal of significant portions of the solvent during the formation of the polyimide. The removal of tetrahydrofuran and N-methylpyrrolidinone can be done without the use of preheating zones so as to allow for the large scale production of polyimide articles.
Claims
exact text as granted — not AI-modified1 - 13 . (canceled)
14 . A polyimide laminate comprising:
a polyimide layer; and a metal foil, wherein said polyimide laminate is produced by casting a polyamic acid precursor comprising at least one diamine and at least one anhydride in a cosolvent of tetrahydrofuran and N-methylpyrrolidinone onto a surface of the metal foil, followed by heating the polyamic acid solution to form the polyimide layer.
15 . The polyimide laminate of claim 14 wherein said polyamic acid precursor contains an amount of tetrahydrofuran ranging from about 1% to about 90% by volume of solvent of tetrahydrofuran and N-methylpyrrolidinone.
16 . The polyimide laminate of claim 14 wherein said polyamic acid precursor further contains at least 1% weight of an inorganic filler selected from the group consisting of mica, silica, calcium carbonate, calcium phosphate, calcium silicate, talc, and a combination thereof.
17 . The polyimide laminate of claim 14 wherein the at least one anhydride comprises 4,4′-oxydiphthalic anhydride and 3,3′-biphenyltetracarboxylic dianhydride.
18 . The polyimide laminate of claim 17 wherein the mole ratio of 3,3′,4,4′-biphenyltetracarboxylic dianhydride to 4,4′-oxydiphthalic anhydride ranges from about 25% to about 75% 3,3′,4,4′-biphenyltetracarboxylic dianhydride.
19 . The polyimide laminate of claim 17 wherein the mole ratio of 3,3′,4,4′-biphenyltetracarboxylic dianhydride to 4,4′-oxydiphthalic anhydride is about 50% 3,3′,4,4′-biphenyltetracarboxylic dianhydride.
20 . The polyimide laminate of claim 14 wherein the diamine is 3,4′-oxydianiline.
21 . The polyimide laminate of claim 14 wherein the polyamic acid precursor is quantitatively pumped and fed through a slit die and cast onto a surface of a metal foil.
22 . The polyimide laminate of claim 14 wherein the metal foil is copper.
23 - 26 . (canceled)Join the waitlist — get patent alerts
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